Bluetooth SiP module has one of the smallest footprints for IoT end nodes

Silicon Labs has introduced what is claimed to be the industry’s smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5mm x 6.5mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB footprint including the antenna clearance area to 51mm2. Applications for this ultra-small, high-performance Bluetooth module include sports and fitness wearables, smartwatches, personal medical devices, wireless sensor nodes and other space-constrained connected devices. Based on their Blue Gecko wireless SoC, the module provides an all-in-one Bluetooth connectivity solution featuring an ARM Cortex-M4 processor, high-output Bluetooth power amplifier, high-efficiency onboard antenna, external antenna options, oscillators and passives, along with a reliable, secure Bluetooth 4.2 stack and best-in-class development tools. The module’s high level of SiP integration frees developers from the complexities of RF system engineering, protocol decisions and antenna design so that they can focus on their end applications. The module’s exceptionally small size makes it easy to use in space-sensitive, battery-powered applications including low-cost, two-layer PCB designs. “Small size is as critical to IoT end node design as ultra-low power, low system cost and high levels of integration,” said Daniel Cooley, senior vice president and general manager of IoT products at Silicon Labs. “Great things really do come in small packages, and there’s nothing quite like the BGM12x module in the Bluetooth low energy market. The BGM12x SiP module enables developers to design compact Bluetooth designs quickly and easily by integrating all required hardware and software components including a Bluetooth 4.2 compliant stack.” The module provides developers the flexibility to begin with a module-based design and then transition to a Blue Gecko SoC with minimal system redesign and full software reuse. To help developers further miniaturize wearable designs and other Bluetooth-enabled IoT products, SoCs will be available in an ultra-small (3.3mm x 3.14mm x 0.52mm) wafer-level chip-scale package (WLCSP). The module is pre-certified for use in many key global markets, minimizing development costs and RF regulatory compliance effort for developers. All application code can be executed on the module, eliminating the need for an external MCU, which helps reduce system cost and board space and speeds time to market. Bluetooth low energy application profiles and examples are also available to streamline development.