AVX – New series of multilayer organic high pass filters for wireless applications

AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released a new series of low profile, high pass filters with best-in-class performance. Based on the company’s patented and proven multilayer organic (MLO) high density interconnect technology, the new HF Series MLO high pass filters utilize high dielectric constant and low loss materials to help engineers integrate high Q passive printed elements, such as inductors and capacitors, in multilayer stacks with land grid array surface mount packaging that’s expansion-matched to most organic printed circuit board materials, providing improved reliability over standard silicon and ceramic devices. Exhibiting low insertion loss, excellent rejection of out of band frequencies, low parasitics, favorable heat dissipation characteristics, and 50Ohm impedance, the new filters feature an ultralow maximum profile height of 0.559mm, and support both a wide frequency range (0.74GHz – 2.83GHz) and several wireless standards, making them ideal for use a variety of wireless applications, including: mobile communication devices, GPS, vehicle location systems, wireless local area networks (LANs), satellite receivers, and instrumentation. “Our new HF Series MLO high pass filters allow wireless design engineers to achieve lower insertion loss, better attenuation, and better heat dissipation than designs that utilize LTCC products. MLO filters integrate inductors and capacitors into a small, low profile package, thereby eliminating the need to construct filters using discrete capacitors and inductors. This improves performance and reliability, reduces the required board placement space, and removes the need for tuning using individual capacitors and inductors,” said Edgardo Menendez, worldwide business manager of RF/Microwave Ceramics at AVX. “These qualities, combined with the series’ extremely low profile, are critical to enabling the development of the smaller, more capable wireless electronics that the market demands.”