One part silver conductive epoxy offers ultra-high heat transfer capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was created for critical thermal management applications. As a one component system, it is not premixed and frozen and has an 'unlimited' working life at room temperature. This compound has a high thermal conductivity of 45-49BTU•in/ft2•hr•F [6.5-7W/(m•K)]. It can be applied in ultra-thin bond lines and contains particles with an average size of 2-3 microns. Most importantly it exhibits an extremely low thermal resistance of 2-3x 10-6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001Ohm-cm. The adhesive meets NASA low outgassing specifications and is serviceable from -80F to +450F [-62C to +232C]. This product adheres well to similar/dissimilar substrates such as aluminium, ceramic, copper, fibreglass, polyimide and silicone die. This formulation is designed to cure in 20-30 minutes at 250F or 5-10 minutes at 300F. Die shear strength has a 20-20Kg-f value at 75F measured for a die size of 2x2 mm [80x80mil]. The adhesive is packaged in syringes or glass jars. Common sizes range from 20g, 50g, 100g to one and multiple pound units. For storage, simple refrigeration is recommended. Shelf life is a minimum of three months in original unopened syringes or jars.