Graphene filled epoxy offers excellent thermal conductivity

Master Bond EP30NG is a two-part epoxy adhesive system developed for applications that demand high thermal conductivity. It contains a speciality graphene filler which contributes not only to its high compressive strength but also to its enhanced dimensional stability. The adhesive achieves an extraordinary thermal conductivity of 38.15BTU•in/(f²•hr•F) [5.5W/(m•K)] at room temperature while its compressive strength measures 22,000-24,000psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/C and exhibits a Shore D hardness of 85-95. According to Rohit Ramnath, senior product engineer, "EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm since graphene nanoparticles tend to agglomerate to form larger particles." This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency, and Part B is a low viscosity liquid. The product bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60F to +300F. The product is available in 30cc jar kits, 1/2 pint kits, and pint kits.