RF front-end ICs for Wi-Fi 6 modules

NXP Semiconductors has collaborated with Murata, a SiP integrator for 5G mobile platforms, to provide what is claimed to be the industry’s first RF front-end modules created with the latest Wi-Fi 6 standards. Together, the companies are providing a solution that can decrease design times, enhance time-to-market and save board space in next-generation Wi-Fi 6 implementations.

The solution is tightly packed in a chip-scale package suitable for module integration and can support various 5G smartphones and portable computing devices. Additionally, it enables high performance 2x2 MIMO functionality.

“Murata is very pleased to work with NXP to develop RF front-end modules for Wi-Fi 6 platforms — NXP’s monolithic front-end ICs are fully verified in leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration,” said Katsuhiko Fujikawa, R&D manager of Murata Manufacturing Co Ltd. “We plan to continue working with NXP and hope to develop newer modules in forthcoming years that support new spectrums and standards.

“Working with Murata helps manufacturers deliver a highly integrated, fully tested and qualified solution for 5G devices while providing the highest performance and smallest size to meet rapidly rising global demand for Wi-Fi 6,” said Paul Hart, senior vice president and general manager of NXP’s Radio Frequency business. “No other chipmaker in the industry today can provide a comparable solution to meet demands of rapid deployments.”