07-12-2020 | Nexperia | Semiconductors
Nexperia has released new leadless ESD protection devices for CAN-FD applications. Devices are offered in leadless packages with side-wettable flanks that allow AOI tools to be employed. Fully AEC-Q101-qualified, the PESD2CANFDx series parts also provide industry-leading ESD and RF performance and save PCB space.
The company provides silicon-based ESD protection for the CAN-FD bus in both leaded and leadless packages. The new DFN1412D-3 and DFN1110D-3 leadless DFN packages with side-wettable flanks occupy 80% less PCB space than standard SOT23 and SOT323 packages. Despite this, products constructed in this package offer improved thermal behaviour due to a bigger internal lead frame that incorporates a heatsink and thermal pad.
The diodes are also very ESD robust providing superior system-level protection performance. This is because the parts have the industry’s lowest clamping voltages of only 33V at IPP = 1A and low dynamic resistance of 0.7Ohm. The company's ESD protection devices also provide excellent RF switching parameters providing a mixed-mode insertion loss of only +20dB at 300MHz, leading to superior signal integrity.
Nexperia’s product manager, Lukas Droemer, commented: “CAN-FD is an important bus in automotive in-vehicle networks, but devices must be protected against ESD. Another essential requirement for automotive applications is the ability to use AOI. Our new devices in leadless packages meet both these requirements, providing a high-performance alternative to leaded SMD packages. The PESD2CANFDx series fulfils all CAN (FD) specification requirements and exceeds the requirements of AEC-Q101 by two times.”