27-05-2022 | Murata | Subs & Systems
Murata has collaborated with NXP Semiconductors to develop the Type 1XL extremely high-performance Wi-Fi 6 and Bluetooth 5.3 module. Utilising proprietary packaging and miniaturisation technologies, it continues its lead in delivering high quality, low power, small form factor communication modules at the lowest cost to assist in bringing IoT to the mass market.
“The wireless communication bandwidth is tightening within our homes and offices with more streaming content, such as 4K/8K video, and traffic increase by teleworking and remote video conference calls,” says Akira Sasaki, manager of the IoT Module Department at Murata. “The low cost, space-saving Type 1XL module enables high-speed communication, which significantly improves quality.”
Based on the NXP 88W9098 combo chipset, the ultra-small dual-band module supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy. The Wi-Fi section of the module supports connectivity up to 1.4x faster than traditional Wi-Fi compatible devices, delivering data rates of up to 1200Mbps. This section also supports the PCIe 3.0 interface with optional support for SDIO 3.0. The Bluetooth 5.3 LE section supports speeds of up to 2Mbps with a high-speed four-wire UART interface, optional support for SDIO, and PCM for audio data.
The module utilises highly sophisticated and enhanced hardware mechanisms and algorithms to optimise Wi-Fi and Bluetooth coexistence for ultimate performance. The module size is 19.1mm (L) x 16.5mm (W) x 2.1mm (H), enabling integration into size- and power-sensitive electronic devices for IoT, smart home, audio/video/voice, smart TV, and gateway applications. It will have a reference antennae design for FCC/IC certifications and CE conducted test to deliver a lower development cost and faster time to market.
