Combining high placement accuracy with short cycle times and innovative bonding

With its new version of the AMICRA NOVA Pro, ASMPT offers one of the most advanced die-bonding systems. The platform combines high placement accuracy, short cycle times, and innovative bonding technologies.

“For speedy data transmissions for precise sensor technology, you need equally precise manufacturing technologies,” explains Johann Weinhaendler, general manager at ASMPT AMICRA in Regensburg, Germany. “To meet the enormous increase in demand in areas like optoelectronics or advanced packaging, many electronics manufacturers are currently upgrading their lines. Demand is growing particularly strongly in the silicon photonics sector. For example, you can produce active optical cables for 400/800 Gigabit/sec networks or co-packaged optics with the NOVA Pro.”

The device places dies in sizes ranging from 0.1mm to 25mm with a maximum accuracy of ±1µm @ 3σ at speeds of up to 1000 units per hour (UPH). At ±3µm @ 3σ, it achieves even 3500 UPH. This impressive level of performance is also attained in flip-chip mode.

The device provides its trend-setting placement accuracy with its unique dynamic alignment method and laser-based substrate heating technology. Thanks to its Active Bond Force Control, the machine can dose bonding forces with outstanding precision ranging from 10g to 5000g. Using an epoxy resin stamp with volumetric dosing, the dies can be affixed with adhesives that get UV-cured in place. The repertoire of precision die fastening methods includes in-situ bonding as well as eutectic die bonding with a bonding tool (up to 350C), a ceramic pulse heater (up to 500C), or a contactless laser (up to 450C). An integrated post-bond inspection ensures maximum quality. With its very generous substrate area of 550mm × 600mm, it is aimed at the die-bonding market in advanced packaging applications.

“Anyone who opts for the NOVA Pro benefits from the many years of experience of the market leader, who is fully committed to the goal of zero DPMO,” says Johann Weinhaendler. “The high reserves in terms of precision and performance, as well as the flexible fixation and bonding options, make this machine a future-proof investment.”