High-density power modules enable benchmark performance and TCO for AI data centres

Infineon Technologies AG has launched its TDM2254xD series dual-phase power modules, enabling best-in-class power density, quality and TCO for AI data centres. The series products blend innovation in robust OptiMOS MOSFET technology with novel packaging and proprietary magnetic structure to provide industry-leading electrical and thermal performance with robust mechanical design. This allows data centres to operate more efficiently to meet the high-power demands of AI GPU platforms while significantly lowering TCO.

Given that AI servers need three times more energy than traditional servers and data centres already consume more than 2% of the global energy supply, it is crucial to find innovative power solutions and architecture designs that further drive decarbonisation. Paving the way for the green AI factory, the company's dual-phase power modules combine with XDP Controller technology to allow efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

The company introduced the series at APEC. The modules' unique design allows for efficient heat transfer from the power stage onto the heat sink through a novel inductor design optimised to transfer current and heat, thereby allowing for a 2% higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields considerable energy savings at scale. This translates into megawatts saved for data centres computing generative AI, which leads to reduced CO2 emissions and millions of dollars in operating cost savings over the system's lifetime.

"This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers," said Athar Zaidi, senior vice president, Power and Sensor Systems at Infineon Technologies. "We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalisation and decarbonisation."