First company to validate and ship critical memory for AI data centres

Micron Technology, Inc. leads the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory at speeds up to 5,600MT/s on all leading server platforms. Powered by the company's industry-leading 1β (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

The company's collaboration with industry leaders and customers has yielded wide adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to satisfy the performance demands of a wide range of mission-critical applications in data centres, including AI and ML, HPC, IMDBs, and efficient processing for multithreaded, multicore count general compute workloads. Its 128GB DDR5 RDIMM memory will be supported by a robust ecosystem, including AMD, Hewlett Packard Enterprise, Intel, and Supermicro, along with many others.

"With this latest volume shipment milestone, Micron continues to lead the market in providing high-capacity RDIMMs that have been qualified on all the major CPU platforms to our customers," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "AI servers will now be configured with Micron's 24GB 8-high HBM3E for GPU-attached memory and Micron's 128GB RDIMMs for CPU-attached memory to deliver the capacity, bandwidth and power-optimised infrastructure required for memory-intensive workloads."

"A core tenet of our work with Micron is advancing the capabilities of data centre infrastructure through highly performant memory for compute-intensive workloads," said Dan McNamara, senior vice president and general manager of Server Business Unit, AMD. "Through this collaboration, our joint customers can now get immediate impact out of the high-capacity DDR5 memory offering from Micron in an AMD EPYC CPU powered server, delivering the performance and efficiency needed for the modern data centre."

"Adopting advanced memory capabilities, while ensuring high performance and efficiency, is critical to supporting growing AI workloads in training, tuning, and inferencing," Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "We are committed to providing the most high-performing, energy-efficient solutions, and through our collaboration with Micron, plan to deliver monolithic, high-density DRAM across our AI portfolio to help our enterprise customers gain optimal performance to tackle any workload."

"Micron's 128GB DDR5 RDIMM memory is the first 32Gb monolithic DRAM-based high-capacity DIMM that has completed Intel platform memory compatibility qualification on 4th and 5th Gen Intel Xeon processors," said Dr. Dimitrios Ziakas, vice president of Intel's Memory and IO Technologies, Intel Corporation. "32Gb density based DDR5 DIMMs accelerates critical server and AI system configurations bringing forward key performance, capacity, and most importantly power efficiency benefits to Intel Xeon processor-based systems. We are excited to continue our collaboration with Micron to drive broad adoption of innovative products in the market that solve memory capacity and power bottlenecks for AI and server customers."

"Supermicro is leading the industry with the broadest accelerated server and solution portfolio based on NVIDIA, AMD and Intel," said Wally Liaw, senior vice president of Business Development and co-founder at Supermicro. "Savvy customers are looking for large memory footprint, performance, and efficiency improvements in the AI infrastructure. Customers can benefit significantly from Supermicro's advanced GPU SuperServers with the new 32Gb monolithic DRAM-based 128GB memory, and we are excited to collaborate with Micron to enable this."