Tri-radio module delivers the latest wireless technologies for IoT implementations

15-11-2024 | U-Blox | Semiconductors

The u-blox MAYA-W4 combines Wi-Fi 6, Bluetooth LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem.

u-blox has launched the MAYA-W4, a cost-efficient tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the module is set to redefine the landscape of IoT applications in diverse industries, improving device connectivity and interoperability.

Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile module meets the growing demand for reliable and secure connectivity. Whether facilitating low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, it offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.

The module addresses the market’s need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR. It alleviates network congestion, improves power efficiency, and, with a temperature range of -40C to +85C, is ideal for industrial environments. With its entry-level feature set and optimized data throughput, the module offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 allows low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.

The new module also eases design efforts, allowing manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. The company simplifies migration across previous generations by maintaining the same compact dimensions as its predecessors (10mm x 14mm x 1.9mm).

“The u-blox tri-radio MAYA-W4 module integrates our newly announced NXP Semiconductors IW610 chipset to deliver the latest wireless connectivity technologies to additional segments such as industrial, medical, and consumer,” says Larry Olivas, vice president and general manager of Wireless Connectivity Solutions at NXP. “As a Gold Partner and part of our broader market strategy, u-blox is instrumental in making robust connectivity and an advanced feature set available to our broad market customers. We are excited about the MAYA-W4 and u-blox’s commitment to NXP as a strategic connectivity partner.”

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.