High-temperature relay permits denser board designs

Omron Electronic Components Europe has released the G3VM S-VSON(L) MOSFET relay, which was developed for use in semiconductor test equipment, communication equipment, and test and measurement equipment. The relay can operate at ambient temperatures up to 125C, improving on previous iterations limited to ambient temperatures of 110C. As a MOSFET relay, the device is voltage-driven, removing the necessity for input side resistor selection, while freeing up additional board space.

As applications become smaller and more complex, designers must attempt to fit more components onto each board. However, each electronic component generates heat in operation, which can compromise efficiency and reliability. These relays improved temperature performance permits the design of more densely packed boards. In practice, for testing applications, this can allow more tests to be carried out simultaneously and in a shorter amount of time.

The temperature performance also enables smaller application designs, as the G3VM can withstand higher heat dissipation without losing efficiency. The relay weighs just 0.1g and measures 2mm (L) x 1.45mm (D) x 1.3mm (H). The G3VM S-VSON(L) is available in four variants with input forward currents ranging from 0.54mA up to 6.6mA and continuous load current ranging from 0.4A to 1.5A.