New COM Express compact module offers unrivalled AI performance

18-03-2025 | Congatec | Industrial

congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS. This excellent AI performance is driven by the new conga-TC750 COM in the COM Express Compact Type 6 form factor, which is powered by Intel Core Ultra Series 2 processors (codenamed Arrow Lake) with Lion Cove and Skymont P and E-cores, providing up to 16 cores and 22 threads alongside an integrated GPU and NPU.

Developers already working with COM Express Compact platforms (95mm x 95mm), such as the conga-TC700, will gain particularly from the quick upgrade path to unprecedented AI performance. Applications with high-performance requirements – particularly in graphics and AI – can take advantage of Intel's new SoC's enhanced x86 and AI capabilities with minimal development effort and a faster time-to-market.

The SoC achieves 99 TOPS by combining the exceptional AI performance of the integrated Intel Xe-LPG+ graphics processor (iGPU) – optimised for parallel, high-throughput workloads and delivering up to 77 TOPS (compared to its predecessor Meteor Lake's 18 TOPS) – with a highly energy-efficient NPU providing up to 13 TOPS, and a CPU contributing 9 TOPS for fast response times. The new SoC also features Intel's latest Xe-LPG+ graphics engine. With its standardised module concept enabling simple upgrades and high scalability, the conga-TC750 is an excellent choice for high-performance IPCs and thin clients, allowing them to stay updated with easy module replacements. Also, AI-supported medical imaging, test and measurement, and graphics-based applications benefit greatly from the new module's significant performance.

"Our new conga-TC750 COM Express Compact modules with Intel Core Ultra Series 2 processors are ideal for applications that always require the latest performance and follow innovation cycles of three to five years. The module concept excels in these scenarios, providing an application-ready computing core that helps developers save time and costs during design-in, scale easily, and achieve a shorter time-to-market. By replacing modules while retaining the carrier board, developers avoid the expense and effort of a full system replacement or redesign," explains Maximilian Gerstl, product manager at congatec.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.