New hybrid flyback controller ICs for ultra-high power density designs

Following the launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG introduces the E-version of its hybrid flyback controller family. Developed for high-performance applications, the new XDP hybrid flyback digital controller family employs the advanced asymmetrical half-bridge (AHB) topology, which combines the simplicity of a flyback converter with the efficiency of a resonant converter, allowing high power density designs. This makes the controllers ideal for various AC/DC applications, including aftermarket and OEM chargers, adapters, power tools, e-bike chargers, industrial switching power supplies, TV power supplies, and LED drivers.

The hybrid flyback topology offers several advantages over ACF and LLC resonant converters. It lessens magnetic energy storage and operates with lower leakage inductance, resulting in a smaller transformer size. HFB attains high efficiency across a wide output range and minimises power losses through multimode operation, lowering standby power consumption and improving efficiency at low loads for compliance with Certificate of Conformity (CoC) Tier 2 and Department of Energy (DoE) 7 regulations. These characteristics make HFB ideal for compact, efficient power supply designs. With patent-pending improved PFC features, synchronised PFC and HFB start-up behaviour, and optimisation for the latest CoolGaN transistors, the E-version of the hybrid flyback ICs further enhances performance in power conversion applications. Furthermore, simplified parameter configuration and a comprehensive design tool and guide support efficient implementation in advanced designs.