Next-gen high-density power modules for VPD in AI data centres

Infineon Technologies AG offers the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. The new OptiMOS TDM2454xx quad-phase power modules enable best-in-class power density and TCO for AI data centre operators through improved system performance and its trademark robustness.

The power modules facilitate true vertical power delivery (VPD) and deliver the industry's best current density of two Ampere per mm². The modules follow the OptiMOS TDM2254xD and the OptiMOS TDM2354xD dual-phase power modules introduced by the company last year and continue to facilitate superior power density for accelerated compute platforms. In conventional horizontal power delivery systems, power needs to travel across the surface of the semiconductor wafer, which can result in higher resistance and notable power loss. Vertical power delivery minimises the distance that power needs to travel, thereby decreasing resistive losses enabling increased system performance.

According to the IEA, Data centres are responsible for 2% of global energy consumption. Fueled by AI, the power demands within data centres are expected to grow by 165% between 2023 and 2030. Continually improving the efficiency and power densities of power conversion from grid-to-core is vital to enable further advancements in compute performance while reducing TCO.

"We are proud to expand our high-performance AI data centre solutions with the OptiMOS TDM2454xx VPD modules," said Rakesh Renganathan, vice president of Power ICs at Infineon Technologies. "We take a three-dimensional design approach and leverage our industry-leading power devices, packaging technologies and extensive systems expertise to provide high-performance and energy-efficient computing solutions as part of our mission to drive digitalisation and decarbonisation."

The OptiMOS TDM2454xx modules are a fusion of Infineon's robust OptiMOS 6 trench technology, a chip-embedded package for superior electrical and thermal efficiencies, and innovative low-profile magnetic design that continues to push the envelope for performance and quality of VPD systems. Additionally, the OptiMOS TDM2454xx has a footprint designed to enable module tiling and improve current flow, which enhances electrical, thermal, and mechanical performance. The OptiMOS TDM2454xx modules support up to 280A across four phases with an integrated embedded capacitor layer within a small 10x9mm² form factor. Combined with Infineon's XDP™ controllers, they offer a robust power solution with improved system power density.

The OptiMOS TDM2454xx modules further strengthen the company's unique position in the market, with the widest product and technology portfolio based on all relevant semiconductor materials, and power different AI server configurations from grid to core in the most energy-efficient way.