SiC-based intelligent power modules reduce energy consumption and system cost

onsemi has introduced the first generation of its 1200V SiC MOSFET based SPM 31 IPMs. These IPMs deliver the highest energy efficiency and power density in the smallest form factor compared to utilising Field Stop 7 IGBT technology, resulting in lower total system cost than any other leading solution on the market. Their improved thermal performance lowered power losses, and ability to support fast switching speeds make these IPMs ideal for three-phase inverter drives applications such as EC fans in AI data centres, heat pumps, commercial HVAC systems, servo motors, robotics, variable frequency drives (VFDs), and industrial pumps and fans.

The IPMs provide several current ratings from 40A to 70A. Complemented by the company's IGBT SPM 31 IPM portfolio, covering low currents from 15A to 35A, it now provides the industry's broadest range of scalable and flexible integrated power module solutions in a small package.

In 2023, operations of residential and commercial buildings accounted for 27.6% of US end-use energy consumption. As electrification and AI adoption grow, particularly with the construction of more AI data centres and increasing energy demands, the necessity of reducing the energy consumption of applications in this sector is becoming more critical. Power semiconductors capable of efficiently converting electric power are the key to this transition to a low-carbon-emissions world.

With the number and size of data centres growing, the demand for EC fans is expected to rise. These cooling fans maintain the ideal operating environment for all equipment in a data centre and are essential for accurate, error-free data transmission. The SiC IPM ensures that the EC fan operates reliably and efficiently.

Like many other industrial applications such as compressor drives and pumps, EC fans need higher power density and efficiency than existing larger IGBT solutions. By switching to these IPMs, customers can benefit from a smaller footprint, higher performance, and a simplified design due to high integration, resulting in shortened development time, lower total system cost, and reduced GHG emissions. For example, compared to a system solution that uses a current IGBT PIM with power losses of 500W at 70% load, implementing highly efficient IPMs could lower the annual energy consumption and cost per EC fan by 52%.

The fully integrated EliteSiC SPM 31 IPM comprises an independent high side gate driver, low voltage integrated circuit (LVIC), six EliteSiC MOSFETs and a temperature sensor (voltage temperature sensor (VTS) or thermistor). The module is based on the industry-leading M3 SiC technology that shrinks die size and is optimised for hard-switching applications with improved short-circuit withstand time (SCWT) performance when used in the SPM 31 package, making them suited for inverter motor drives for industrial use. The MOSFETs are configured in a three-phase bridge with separate source connections for the lower legs for maximum flexibility in the choice of control algorithm.