Efficient Power Conversion (EPC) has introduced the EPC2367, a next-generation 100V eGaN FET that delivers superior performance, higher efficiency, and lower system costs for power conversion applications.
Designed for 48V intermediate voltage bus architectures, the device greatly advances the performance of power systems by decreasing power loss, increasing efficiency, and allowing more compact and cost-effective designs. This new device sets a benchmark in performance compared to previous-generation GaN and traditional silicon MOSFET solutions.
The device delivers ultra-low on-resistance (RDS(on)) of 1.2mOhm, a 30% improvement over previous generation best-in-class devices. It provides a smaller footprint of 3.3mm × 3.3mm QFN package, decreasing PCB space and improving thermal performance. It offers best-in-class switching FoM, outperforming competitors in hard and soft-switching applications, providing superior efficiency and lower power losses. Enhanced thermal performance enables it to operate cooler under load, improving system reliability and allowing higher power densities. Its outstanding Temperature Cycling Reliability of 4× the thermal cycling capability compared to previous GaN generations ensures robust long-term operation.
The EPC2367 has been rigorously tested in hard and soft-switching applications. Performance results demonstrate higher efficiency across the full power range, with significant power loss reductions. A 1MHz, 1.25kW system decreases power losses while achieving 1.25× the output power compared to previous GaN and Si MOSFET alternatives.
“The EPC2367 advances GaN technology with ultra-low on-resistance and superior thermal cycling, enabling engineers to boost efficiency and power density in AI servers, robotics, and automotive systems,” said Alex Lidow, EPC CEO and co-founder.
The EPC90164 development board is a half-bridge featuring the EPC2367 GaN FET. It is designed for 80V maximum operating voltage and 35A maximum output current. This board aims to simplify the evaluation process of power systems designers to speed up their product’s time to market. This 2” x 2” (50.8mm x 50.8mm) board is designed for optimal switching performance and contains all critical components for easy evaluation.
Visit the company at PCIM Europe, in Hall 9 - 318, from 6-8 May 2025.