New high-speed optimised flip-chip package technology for automotive ESD protection

New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with the industry's first side-wettable flank versions

Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimised for protecting and filtering high-speed data communication links, which are increasingly used in modern cars. Applications like in-vehicle camera video links, multi-gigabit automotive Ethernet networks, and infotainment interfaces like USBx, HDMIx, and PCIex can be protected against potentially damaging ESD events.

Flip-chip packages have minimal parasitic components – they come without bond wires or copper lead frames, resulting in high performance and outstanding signal integrity. Nexperia's new 2- and 3-pin FC-LGA diodes have ultra-low capacitance (<0.25 pF) and insertion loss (-3dB at 14.6GHz) – features that are key for usage in high data rate applications. Both flip-chip packages, the 2-pin DFN1006L(D)-2 and the 3-pin DFN1006L(D)-3 share the same footprint as their standard counterparts, providing drop-in compatibility. They offer up to 6GHz bandwidth improvement compared to conventional DFN technologies. Moreover, the 3-pin devices' ability to protect two channels and offer capacitance matching saves more space while enhancing circuit performance and stability.

Apart from delivering best-in-class signal integrity, this family of diodes also comes with the industry's widest range of reverse working voltages (Vrwm), including 5V, 18V, 24V and 30V options. Higher voltage devices supply the additional advantage of flexible board placement for protecting multiple devices connected at various points along a link. With products like the PESD5V0H1BLG-Q in DFN1006LD-2 and PESD5V0H2BFG-Q in DFN1006LD-3 packaging, the company is the only supplier to offer ESD protection diodes in flip-chip packaging with SWF. This allows AOI of solder joints to ensure that they meet the exacting quality necessities of the automotive industry, where safety is paramount.

"These new diodes combine side-wettable flanks with a DFN1006 footprint optimised for maximum signal integrity and represent a significant improvement to the options currently available. Designed to support the growing trend of data-intensive automotive applications, they reflect Nexperia's proven expertise in packaging technology. This launch reinforces our commitment to delivering innovative solutions that meet the evolving demands of engineers across a wide range of industries," says Alexander Benedix, head of Product Group Protection and Filtering at Nexperia.