Paul Whytock

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Paul Whytock is Technology Correspondent for Electropages. He has reported extensively on the electronics industry in Europe, the United States and the Far East for over thirty years. Prior to entering journalism, he worked as a design engineer with Ford Motor Company at locations in England, Germany, Holland and Belgium.

Wireless charging finally connects with the consumer. Or has it?

Wireless power transmission was first tried by inventor Nikola Tesla in the early 1900s and if recent reports from industry analysts are correct it now seems that consumers are fin

Insights | 23-05-2016

This programmable ASSP can bridge those interface gaps

What is claimed to be the first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays has been developed

Articles | 17-05-2016

This programmable ASSP can bridge those interface gaps

What is claimed to be the first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays has been developed

Insights | 17-05-2016

This driver technology can cope with 1200V Apps

Driver ICs that have output currents from 2.5 to 8A have been developed by power electronics company, Power Integrations. The company says this is the highest output current perfor

Articles | 12-05-2016

This driver technology can cope with 1200V Apps

Driver ICs that have output currents from 2.5 to 8A have been developed by power electronics company, Power Integrations. The company says this is the highest output current perfor

Insights | 12-05-2016

PCIM Europe 2016. The first day highlights

MOSFET on-resistance cut by 17% A new generation of super junction (SJ) deep trench semiconductor technology for high-efficient power MOSFETs was unveiled at the show by Toshiba E

Articles | 10-05-2016

PCIM Europe 2016. The first day highlights

MOSFET on-resistance cut by 17% A new generation of super junction (SJ) deep trench semiconductor technology for high-efficient power MOSFETs was unveiled at the show by Toshiba E

In The News | 10-05-2016

PCIM Europe 2016. The first day highlights

MOSFET on-resistance cut by 17% A new generation of super junction (SJ) deep trench semiconductor technology for high-efficient power MOSFETs was unveiled at the show by Toshiba E

Insights | 10-05-2016

These algorithms will keep car-to-car communications safe

ASIC, FPGA and IP specialists EnSilica has designed and launched eSi-ECDSA cryptographic IP to assist with the high security communication and latency requirements of car-to-car (C

Articles | 09-05-2016