Electronics Articles

Electropages Insights Blog covers the latest in electronic design through webinars and articles. Delve into topics from sensors to AI implications. Stay ahead with Electropages.


“With this smart ring I thee monitor”

Just how much technology do humans want attached to them as they go about their daily lives? If consumer organisations have their way we homo sapiens could be carrying more electronics than RoboCop. Why do I mention this? Well, because Bosch Sensortec recently...

Insights | By Paul Whytock | 27-06-2016

Debug interface provides drag and drop programming for OpenSDA

A new version of the J-Link firmware for NXP's evaluation boards with OpenSDA debug and programming interface has been developed by embedded software company SEGGER. OpenSDA is used on the Tower and Freedom evaluation boards equipped with Kinetis microcontroll...

Articles | By Paul Whytock | 22-06-2016

Debug interface provides drag and drop programming for OpenSDA

A new version of the J-Link firmware for NXP's evaluation boards with OpenSDA debug and programming interface has been developed by embedded software company SEGGER. OpenSDA is used on the Tower and Freedom evaluation boards equipped with Kinetis microcontroll...

Insights | By Paul Whytock | 22-06-2016

Solid-State Memory Addresses Navigation, Infotainment and ADAS Needs

Beyond the capabilities of industrial NAND Flash, automotive NAND Flash features advanced data-care management, diagnostic, protection and security features. By Rolf Schroeder, Swissbit. Offering fashionable looks, do-anything features and always-connected...

By Rolf Schroeder | 22-06-2016

The hidden thermal contributors in high power density designs

It seems that more and more features are being packaged into smaller electronic modules. Due to the ever-increasing power density of such modules, it is difficult for electronics engineers to keep things running cool. Here, I review a thermal design issue whic...

Articles | By Mark Scholton | 21-06-2016

The hidden thermal contributors in high power density designs

It seems that more and more features are being packaged into smaller electronic modules. Due to the ever-increasing power density of such modules, it is difficult for electronics engineers to keep things running cool. Here, I review a thermal design issue whic...

Insights | By Mark Scholton | 21-06-2016

Bluetooth 5 promises greater range, double the speed and a big broadcasting boost

Significantly increased range, speed and broadcast messaging capacity are some of the attributes that the Bluetooth Special Interest Group (SIG) is promising with the launch of Bluetooth 5. Expected later this year, Bluetooth 5 is predicted to provide reliable...

Articles | By Paul Whytock | 17-06-2016

Bluetooth 5 promises greater range, double the speed and a big broadcasting boost

Significantly increased range, speed and broadcast messaging capacity are some of the attributes that the Bluetooth Special Interest Group (SIG) is promising with the launch of Bluetooth 5. Expected later this year, Bluetooth 5 is predicted to provide reliable...

Insights | By Paul Whytock | 17-06-2016

This Fanless Power Supply Platform Can Deliver 600W

A convection-cooled modular power supply platform that delivers 600W without fan-assisted cooling has been developed by Excelsys Technologies. Claimed by the company to be the only fanless modular power supply on the market, the CoolX600 comes in an 8.5 x 4.5...

Articles | By Paul Whytock | 15-06-2016

This Fanless Power Supply Platform Can Deliver 600W

A convection-cooled modular power supply platform that delivers 600W without fan-assisted cooling has been developed by Excelsys Technologies. Claimed by the company to be the only fanless modular power supply on the market, the CoolX600 comes in an 8.5 x 4.5...

Insights | By Paul Whytock | 15-06-2016

Chip and software firms team up to develop secure connected-car apps

Automotive embedded systems specialist ETAS and embedded software security company ESCRYPT have teamed up with power semiconductor company STMicroelectronics in a development project focussing on secure connected car applications. Automotive engineers increasi...

Articles | By Paul Whytock | 14-06-2016

Chip and software firms team up to develop secure connected-car apps

Automotive embedded systems specialist ETAS and embedded software security company ESCRYPT have teamed up with power semiconductor company STMicroelectronics in a development project focussing on secure connected car applications. Automotive engineers increasi...

Insights | By Paul Whytock | 14-06-2016