Industrial


ARM 32-bit extension unlocks new deployment options for edge connector products

By integrating ARM 32-bit compatibility into its edgeConnector products, Softing Industrial is reacting to the increasing need for edge applications using ARM processors. Previously, these solutions were only obtainable for integration i

Softing | 24-01-2024

Bluetooth 5.4 dual-mode modules for low-power Bluetooth transition in IoT apps

Mouser now stocks the Vela IF820 Bluetooth 5.4 dual-mode modules from Laird Connectivity. Meeting the ever-evolving demands of modern Bluetooth applications, the modules marry the benefits of Infineon Technologies' low-power, high-performan

Mouser Electronics | 23-01-2024

PCB assembly demonstration of company's expertise

Corintech has announced its participation in the upcoming Southern Manufacturing & Electronics 2024 show. The company plans to demonstrate its expertise in PCB assembly at this year's event, where it has built a great reputation for qua

CorinTech Ltd | 23-01-2024

Combining high placement accuracy with short cycle times and innovative bonding

With its new version of the AMICRA NOVA Pro, ASMPT offers one of the most advanced die-bonding systems. The platform combines high placement accuracy, short cycle times, and innovative bonding technologies. “For speedy data transmissions

ASMPT | 23-01-2024

Slim embedded computers demonstrate the power of one computer/two purposes

Cincoze has deepened its embedded computer range. Customers have widely favoured two newly launched industrial computers (P2202 Series and P1201) for their thin and light design, particularly in mobile devices (AGV/AMR), control cabinets, a

Cincoze | 23-01-2024

Low power consumption dual-core BLE SoC with integrated flash

Renesas Electronics Corporation has introduced the DA14592 BLE SoC, which represents its lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) BLE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/

Renesas | 23-01-2024

Upgraded series of IR receiver modules with new in-house IC

Vishay Intertechnology, Inc. has upgraded its TSOP18xx, TSOP58xx, and TSSP5xx series of IR receiver modules for remote control, proximity sensing, and light barrier applications. Supplied in Minicast packages, the enhanced solutions offer d

Vishay | 22-01-2024

New AC fans product line added to thermal management portfolio

CUI Devices’ Thermal Management Group has added AC fans to its product portfolio. The CAF family is a range of AC axial fans offering frame sizes of 120mm or 172mm and airflows from 44.69 to 164.5 CFM. Available with ball bearing or sleeve

CUI Devices | 22-01-2024

Window cache boosts the performance of graphic library

SEGGER has introduced a window cache feature for the emWin embedded graphics library, typically increasing performance by a factor of four in larger systems with sufficient RAM. The content of each window or widget is automatically cache

Segger | 22-01-2024

Latest high-end performance gaming platform launched

Advantech-Innocore has released the latest product of the highly successful and proven DPX-S Series gaming platform, the DP-S455. This premium hardware is powered by Intel 12th and 13th Generation processors, providing high performance a

Advantech | 22-01-2024

Arm Cortex-M85 MCUs with Helium and TrustZone

Mouser now offers the RA8M1 and RA8D1 MCUs from Renesas Electronics. The RA8x1 MCUs are the industry's first 32-bit microcontrollers based on an Arm Cortex-M85 (480MHz) core with Helium, supplying breakthrough performance of over 3000 corem

Mouser Electronics | 19-01-2024

Next-generation family of Ethernet switches provide TSN

Microchip Technology has announced its next-generation of LAN969x Ethernet switches with TSN, scalable bandwidths from 46Gbps to 102Gbps and a powerful 1GHz single-core Arm Cortex-A53 CPU. The switches can be configured with High-availab

Microchip Technology | 19-01-2024

Showcasing ultra-efficient MOSFET modules for the first time

SemiQ will exhibit its latest portfolio of advanced SiC modules at the Applied Power Electronics Conference (APEC). Visitors to the company's booth will have the first opportunity to explore the latest QSiC 1200V SiC modules. These modul

SemiQ | 19-01-2024

Demo kit for ultrasonic sensor modules used for obstacle detection

TDK Corporation offers a demo kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS. This component can be used for obstacle detection and distance measurement under demanding environmental conditions, including full s

TDK | 19-01-2024

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