Pasternack has increased its highly reliable 12G SDI interconnects line engineered to maximise 4K and ultra-HD video signal transmission. Its new cables and connectors are intended for high durability and reliability. They provide 10µin

Pasternack | 16-12-2022

Vector presents its compact multi-gig USB-to-Ethernet adapter VN5601. The adapter is not just high performing; its compact dimensions make it ideal for portable use and provide an easy connection to Vector hardware. This new adapter can be

Vector | 16-12-2022

Moxa's newly released AIG-100 Series incorporates best-in-class IIoT gateways that help fulfil a user's IIoT targets with the lowest total cost of ownership by concentrating on distributed energy-resource applications, particularly in solar

Moxa | 16-12-2022

Saelig Company, Inc now offers the ABI Multiple Instrument Station MIS4 Test Station, an all-in-one testing tool that combines in a compact case all typically required test instruments in a compact and programmable hardware module. Controll

Saelig | 16-12-2022

TDK Corporation offers the ModCapTM HF, a modular capacitor concept for DC link applications that can work at extremely high switching frequencies. The six new power capacitors of the B25647A* series are offered for rated voltages from 900V

TDK | 16-12-2022

Mouser now ships the FlexPIFA 2dBi and FlexPIFA 3dBi antennas with MHF1/U.FL cables from Laird Connectivity. These are the industry's first flexible Planar Inverted-F Antennas (PIFA) developed for Wi-Fi or Bluetooth applications mounted on

Mouser Electronics | 15-12-2022

Amphenol RF has expanded its alternate plating portfolio with a new RF connector developed for applications in demanding environments needing a more ruggedised solution. The extreme exposure RF interconnect has an additional SMA bulkhead ja

Amphenol | 15-12-2022

The new Leuze LS25CI throughbeam photoelectric sensor is powerful and flexible and transilluminates even metallised and dark films – meeting the stringent demands of the packaging industry. The films employed in the packaging industry va

Leuze | 15-12-2022

u-blox has released the ANT-B11 compact antenna board. By incorporating Bluetooth technology with the company's unique expertise, this board provides high-precision direction finding and 2D indoor positioning. It can be incorporated into co

U-Blox | 15-12-2022

Infineon Technology is adding the XMC7000 series to its microcontroller portfolio. The XMC7100, the XMC7200, and the associated evaluation kit are available from Rutronik. The new MCU family includes a single- or a dual-core Arm Cortex-M

Rutronik | 15-12-2022

ROHM has recently created wide terminal shunt resistors, LTR10L. They are optimised for various automotive, industrial, and consumer applications whilst bolstering the expansive lineup with two updated general-purpose MCR series shunt resis

ROHM Semiconductor | 15-12-2022

Unique, Z-axis compression CIN::APSE interconnects from Cinch delivering superior mechanical and electrical performance under the most severe mechanical shock, and vibration conditions can now be obtained from Powell Electronics. The high-d

Powell Electronics | 15-12-2022

Mouser now stocks the i.MX RT117F crossover processors from NXP Semiconductors. They expand on the company's EdgeReady portfolio, the crossover processors provide a low-cost, embedded, secure 3D facial recognition solution. This innovative

Mouser Electronics | 14-12-2022

Teledyne FLIR has introduced six new cameras to its Blackfly S GigE line. These include the BFS-PGE-80S5M/C-C featuring 8MP Sony IMX546: colour and mono; BFS-PGE-120S6M/C-C featuring 12.3MP Sony IMX545: colour and mono; and BFS-PGE-200S7M/C

Teledyne FLIR | 14-12-2022