Winbond Electronics Corporation offers its new package 100BGA LPDDR4/4X, announcing it had achieved the JEDEC JED209-4 standard to provide energy conservation and carbon reduction. The device is now available in a space-saving 100BGA pac
Winbond | 02-08-2022
Mouser has signed an agreement with ATP Electronics for specialised storage and memory solutions. The agreement now provides customers with the company's memory cards, SSDs, and managed NAND devices for industrial and automotive application
Mouser Electronics | 14-07-2022
Alliance Memory has announced its technology lineup for Embedded World 2022. The company will highlight its latest SRAM, DRAM, flash, and storage memory ICs for embedded platforms. "It's been more than two years since Alliance Memory has
Alliance Memory | 16-05-2022
Apacer is launching JEDEC Raw Card Revision 1.0 mass production versions of DDR5 UDIMM, RDIMM, SODIMM, ECC UDIMM and ECC SODIMM industrial memory. As one of the first memory module manufacturers able to start mass production of DDR5, the ga
Apacer | 10-05-2022
Microchip Technology Inc. proposed the concept of starting with COTS devices and then replacing them with space-qualified, RT equivalent parts. The company has announced it has extended its family of COTS-based RT SuperFlash options for the
Microchip Technology | 25-04-2022
SEGGER's Embedded Studio for Arm Version 6 provides real-time memory management, which improves efficiency and response time for allocating and freeing up memory, allowing hard real-time to applications written in C++. This brings the so
Segger | 07-04-2022
KIOXIA Europe GmbH has started sampling new Automotive UFS Ver. 3.1 embedded flash memory devices. The new line-up uses the company’s BiCS FLASH 3D flash memory and is available in capacities from 64GB to 512GB to support the multiple deman
Kioxia | 04-04-2022
Teledyne e2v Semiconductors’ ultra-high-density DDR4 memories are now being shipped to key customers worldwide. With a 4GByte storage capacity and dimensions of only 15mm x 20mm x 1.92mm, Teledyne e2v’s DDR4s display a far higher storage
Teledyne FLIR | 24-03-2022
Hyperstone has released its new S9 family of SD and microSD memory card controllers. In the tradition of its aspiration to offer the most reliable NAND flash controllers, the family satisfies the needs of demanding applications with turnkey
Hyperstone | 10-03-2022
Computing-in-memory technology is balanced to eradicate the massive data communications bottlenecks otherwise associated with performing AI speech processing at the network’s edge. However, it needs an embedded memory solution that simultan
Microchip Technology | 03-03-2022
KIOXIA Europe GmbH announces that the sampling of the industry’s first UFS embedded flash memory devices supporting MIPI M-PHY v5.0 has begun. The new line-up uses the company’s BiCS FLASH 3D flash memory and is offered in three capacities:
Kioxia | 02-03-2022
Kioxia Europe GmbH has released the UFS Ver. 3.1 embedded flash memory devices using its innovative 4-bit per cell quad-level-cell technology. For applications requiring high density, such as cutting-edge smartphones, the QLC technology off
Kioxia | 26-01-2022
Alliance Memory has released a new line of 3V multiple input/output serial NOR flash memory products created to offer supply continuity for Micron Technology customers using discontinued N25Q series devices. Providing support for single, du
Alliance Memory | 29-10-2021
Advantech has released the SQRAM DDR5 4800 series industrial-grade DDR5 memory. This series is offered in diverse form factors and leverages early-access, next-generation DRAM technology to give excellent performance, compatibility, and eff
Advantech | 14-09-2021
03-09-2024 | By Gary Elinoff