Mouser has published the newest issue of its 'Methods' technology and solutions journal. The second issue of volume four, 'Understanding AI', provides a series of perspectives on the issues surrounding AI and ML, as well as their implicatio

Mouser Electronics | 23-07-2021

Mouser has released the third instalment of the 2021 series of its 'Empowering Innovation Together' program. The series’ third instalment dives deep into AI through an engaging collection of video, long-form articles, blog and infographic c

Mouser Electronics | 20-07-2021

NXP Semiconductors has announced a major industry milestone for 5G energy efficiency by integrating GaN technology into its multi-chip module platform. The company claims to be the first to announce RF solutions for 5G massive MIMO that con

NXP | 01-07-2021

Microchip Technology Inc has produced a more flexible and cost-effective alternative with the first multiport PoE PSE injector, also known as a midspan, allowing any multigigabit switch to support these devices’ high powering demands and da

Microchip Technology | 17-06-2021

Harting has developed a component carrier that can be employed directly with electronic components removing manual assembly and replacing flexible PCBs, increasing precision and decreasing assembly cost. The component carrier assists as

Harting Ltd | 17-06-2021

Xilinx, Inc. has introduced the Versal AI Edge series, created to allow AI innovation from the edge to the endpoint. With 4X the AI performance-per-watt versus GPUs and 10X greater compute density against previous-generation adaptive SoCs,

Xilinx | 15-06-2021

Mouser and Molex have partnered to create a new resource site dedicated to high-speed solutions for future trends in connectivity, including 5G and next-generation IoT devices. Almost 75% of mobile service providers have started their 5G

Mouser Electronics | 11-06-2021

CEA-Leti has announced what it claims to be the world’s first autonomous imager technology that activates smartphones and small appliances via face recognition or other particular patterns. Called µWAI (micro-WAY) and sized as small as a

CEA-Leti | 01-06-2021

Silicon Labs has announced that wireless solutions are offered for development of Matter end products that support Thread, Wi-Fi, and Bluetooth protocols. Matter, formerly named ‘Project Connected Home over IP’ or ‘CHIP’, is created to offe

Silicon Laboratories Inc | 14-05-2021

Mouser has launched the 2021 series of its Empowering Innovation Together program, with the release of a new podcast, The Tech Between Us. The new series delves deeper into technology than ever before, including a timely collection of podca

Mouser Electronics | 11-05-2021

Cadence Design Systems has announced it is expanding its collaboration with Arm to expedite hyperscale computing and 5G communications SoC development using Cadence tools and the new Arm Neoverse V1 and Neoverse N2 platforms. Building up

Cadence | 04-05-2021

USB Type-C with Power Delivery (PD) and open-source software are two technologies driving the next wave of wired connectivity. With Microchip Technology’s new PD Software Framework (PSF), designers may now modify and own the IP in their USB

Microchip Technology | 15-04-2021

Cadence Design Systems has optimised the Cadence digital 20.1 full flow for Samsung Foundry’s advanced-process technologies down to 4nm. Within the collaboration, designers can employ the Cadence tools to deliver optimal power, performance,

Cadence | 13-04-2021

Advantech is collaborating with AWS to provide exceptional solutions. Customers uniquely benefit from the pre-integration of the company's WISE-EdgeLink technology and the AWS IoT Greengrass service to connect devices in manufacturing plant

Advantech | 12-04-2021