Laird Thermal Systems has produced a large capacity Direct-to-Air Thermoelectric Assembly (TEA) that allows greater cooling capacity than conventional thermoelectric based systems. Created for refrigeration of medical chambers and analytica

Laird | 05-03-2019

Congatec has introduced its first SOM with AMD embedded processors. The new conga-B7E3 Server-on-Module with the AMD EPYC Embedded 3000 processor is on the cutting edge of embedded server technologies, providing up to 52% more instructions

Congatec | 05-03-2019

Qorvo QPF4001 GaN MMIC Front End Module, available from Mouser, is a multi-function device module targeted for 28GHz phased array 5G base stations and terminals. Fabricated on Qorvo’s 0.15um GaN on SiC process, the device combines a low noi

Mouser Electronics | 04-03-2019

DELO has created an encapsulant with very high resistance to media and temperature. Thanks to an optimised curing time, their MONOPOX GE6515 also expedites production processes. The product is especially well suited for encapsulating electr

DELO | 04-03-2019

Toshiba Electronics Europe has launched a range of single-supply single-gate logic devices. In total the lineup includes 31 devices that ease the design of voltage-level translation as applied in data communication between devices, such as

Toshiba | 04-03-2019

RS Components has introduced the Gen4 Series of integrated TFT LCD modules and related starter packs from embedded graphics specialist 4D Systems. Gen4 display modules are designed for simple integration and use by electronics design engine

RS Components | 01-03-2019

Toshiba Memory Europe has launched a range of four new JEDEC e-MMC Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate the company's 15nm BiCS FLASH 3D flash memory and a controller in a s

Toshiba | 01-03-2019

Mouser has launched at least two new suppliers in the Embedded sector every month on average for the last two years — 54 in total. Covering chips, development tools, and design environments, The company's embedded suppliers supply the full

Mouser Electronics | 28-02-2019

Analog Devices now offers the SHARC Audio Module (ADZS-SC589-MINI), a hardware/software platform that promotes efficient product prototyping, development, and production of a mixture of digital audio products. Producing an innovative blend

Analog Devices | 27-02-2019

Microchip has released what is claimed to be the industry’s smallest IEEE 802.15.4-compliant module that couples an ultra-low-power MCU with a sub-GHz radio, expediting time to market and offering long-lasting battery life in wireless-netwo

Microchip Technology | 27-02-2019

A range of terminal blocks that can withstand extreme temperatures is offered by Hylec-APL. Steatite High-Temperature Terminal Blocks are dimensionally stable up to 1,000C. They are ideal for applications such as boilers, cookers, water he

Hylec-APL | 27-02-2019

Rolec has released their new profiPANEL command enclosures. These stylish, tough and highly versatile enclosures provide a cost-effective solution for housing machine control equipment. IP65-rated the enclosure is perfect for a broad ra

Rolec Enclosures | 26-02-2019

Analog Devices ADMV1013 Wideband Microwave Upconverter is intended for point-to-point microwave radio designs operating in the 24GHz to 44GHz radio frequency range. The upconverter provides two modes of frequency translation. The device

Analog Devices | 25-02-2019

The Microchip RN4678 Bluetooth Dual-Mode Modules are designed with an integral ceramic chip antenna and RF shield to embed Bluetooth functionality into any application. These modules are available now from Mouser. These modules transfer dat

Mouser Electronics | 25-02-2019