congatec has launched a new carrier board design training program to impart best practice knowledge on designing in leading Computer-on-Module standards COM-HPC and SMARC. The aim
Test & Measurement | 03-03-2023
congatec will be presenting its comprehensive COM-HPC ecosystem at Embedded World. The portfolio now includes high-performance COM-HPC Server-on-Modules to ultra-compact and brand-
Industrial | 15-02-2023
congatec now offers the COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. It expects series production of OEM designs ba
Industrial | 11-01-2023
congatec has welcomed the ratification of the COM Express 3.1 standard with the launch of ten compliant COMs based on 12th Gen Intel Core processors (formerly codenamed Alder Lake)
Industrial | 02-12-2022
congatec has introduced its new ecosystem for TSN targeting networked factories and critical infrastructures. The objective of TSN's comprehensive edge computing platform portfolio
Boards | 17-11-2022
congatec has entered the high-end industrial workstation and desktop client market by releasing its first modular Micro-ATX compliant carrier board with COM-HPC interface. The boar
Subs & Systems | 27-07-2022
congatec has announced its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology has achieved SystemReady IR certification within the Arm driven Cassini project.
Subs & Systems | 23-05-2022
congatec has launched new rugged vehicle computing platforms for smart mobility applications in the extended temperature range. Intended to simplify and speed digitisation and auto
Automotive & Transport | 04-04-2022
congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PICMG with the launch of a full specification compliant ecosystem for engineers of COM-HPC Client
Development Boards | 14-02-2022
congatec has introduced the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on ten new COM-HPC and COM Express Computer-on-Modules. Featur
Subs & Systems | 11-01-2022
Congatec has released its new 11th Gen Intel Core processor-based COMs with soldered RAM for the biggest shock and vibration resistance. Created to withstand extreme temperature ra
Subs & Systems | 19-07-2021
Congatec targets customers’ ruggedisation challenges at virtual embedded world 2021. It offers extended temperature range platforms for every performance levels, from high-end COM-
Subs & Systems | 23-02-2021
Congatec has broadened the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by launching th
Subs & Systems | 19-11-2020
In parallel with the 11th Gen Intel Core processor launch (code named 'Tiger Lake'), Congatec has announced the availability of both its first COM-HPC Client size - a module and ne
Subs & Systems | 09-09-2020
