ROHM Semiconductor


World's first trench-type SiC MOSFET minimizes size and power consumption

Rohm has announced the development and mass production of a SiC MOSFET that adopts the world's first trench structure. Compared to existing planar-type SiC MOSFETs, ON resistance i

New Technologies | 03-06-2015

Intelligent new power modules for high-performance switching

Rohm Semiconductor has introduced a new intelligent power module (IPM) family optimized for high speed and power-efficient operation in motor driving and inverter applications.

Products | 28-05-2015

High-efficiency power management IC for Freescale i.MX 6SoloLite processors

Latest from Rohm is news of the development of a high-efficiency power management IC optimized for Freescale Semiconductor’s i.MX 6SoloLite applications processor. The i.MX 6Sol

Products | 24-04-2015

Industry's thinnest full-functional tri-axis accelerometers

Rohm's Kionix group has announced the industry's first ultra-thin full-functional tri-axis accelerometers, the KX112 (2mm x 2mm x 0.6mm) and KXCJB (3mm x 3mm x 0.45mm), which are

Products | 13-03-2015

New SiC MOSFETs target ultra high-voltage pulse generators

Rohm has announced the adoption of its SCT2080KE SiC MOSFET in new, ultra high-voltage pulse generators (SiC-Pulser Series) launched by Fukushima SiC Applied Engineering. Puls

06-03-2015

Compact pressure sensor IC assures accuracy over a wide temperature range

Rohm has unveiled its new family of BM1383GLV piezo-resistive pressure sensors which feature class-leading pressure accuracy and stable measurement at both low and high temperatu

Products | 20-02-2015

New colour sensor for display-equipped devices such as smartphones and tablets

Capable of detecting the colour temperature, brightness, and RGB components of ambient light - a new colour sensor for display-equipped devices such as smartphones and tablets ha

New Technologies | 06-02-2015

Industry's first monolithic EDLC cell-balancing IC

Rohm has announced the development of a cell-balancing IC that contributes to increased miniaturization, greater stability, and longer life for electric double layer capacitors (ED

New Technologies | 30-01-2015