Enhanced LWIR thermal performance with leading SWaP provides low-risk integration for unmanned platforms, security applications, handhelds, wearables, and thermal sights Teledyne FLIR has announced the next-generation embedded software f

Teledyne FLIR | 23-07-2024

PCB Piezotronics has introduced a new Model 378A08 low-noise ¼” (6mm) diameter free-field microphone and preamplifier system with multiple sound field usage capability. The device measures to 25dBA within a low-profile prepolarised (0V) des

PCB Piezotronics | 22-07-2024

Teledyne e2v has announced that the company has qualified and released an upscreened version of the LX2160 to operate between -55C to +125C. The defence-qualified processor implements a 16-core Arm Cortex A72 design providing developers of

Teledyne e2v | 19-07-2024

Microchip Technology has released the first devices in its planned family of PIC64 High-Performance Spaceflight Computing (PIC64-HPSC) MPUs. Unlike previous spaceflight computing solutions, the radiation- and fault-tolerant PIC64-HPSC MP

Microchip Technology | 17-07-2024

Aitech Systems has released the A178-AV, the latest iteration of its smallest rugged GPGPU AI supercomputers available with the powerful NVIDIA Jetson AGX Xavier SoM. With its compact size, the device is the most advanced solution for AI, d

Aitech | 17-07-2024

Inelco Hunter now offers the immediate availability of the Amphenol A Series range of heavy-duty, multi-pin, plastic or metal connectors, cable assemblies and cable accessories. Amphenol Sine Systems’ A Series connectors are part of a gr

Inelcohunter | 16-07-2024

With the launch of its PIC64 portfolio, Microchip Technology expands its computing range to satisfy the rising demands of today's embedded designs. Making the company a single-vendor solution provider for MPUs, the PIC64 family will be desi

Microchip Technology | 15-07-2024

Master Bond Supreme 11AOHTLP is a two-component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since it has a relatively long working life of 60-90 minutes (at r

Masterbond | 15-07-2024

TDK Corporation has introduced its 90kW-rated GSPS 20U 19" racking cabinets to the TDK-Lambda GENESYS+ series of programmable DC power supplies. The GSPS systems seamlessly transition across constant voltage, constant current and constant p

TDK | 12-07-2024

Pasternack has launched its new 45° adapters for in-series connections, 1.85mm. The adapters are designed to connect two systems seamlessly, providing a wide range of high-frequency connections with low VSWR performance, making them an idea

Pasternack | 01-07-2024

Lane Electronics now offers the CINCH Fibreco JUNIOR expanded beam fibre optic connectors from stock. Expanded beam fibre optic connectors were designed to overcome the unreliability of traditional physical contact fibre optic connectors

Lane Electronics | 27-06-2024

Amphenol RF expands its robust RP-TNC connector portfolio with new configurations designed to accommodate micro-coax cable types. Amphenol RF has expanded its robust reverse polarity TNC portfolio with further configurations designed to

Amphenol | 27-06-2024

Samtec's ganged, multi-port SMPM Magnum RF product family is now available with an extremely low-profile 3.94mm (0.155") body height, right-angle option for maximum channel density in low- or mid-band systems. Its GPPC Series offers the ind

Samtec | 27-06-2024

Pasternack has launched its latest product line of RF fixed attenuators with 3.5mm connectors. They are created to fulfil the demanding needs of modern RF applications, offering superior performance and reliability. The new attenuators f

Pasternack | 26-06-2024