COM-HPC provides maximum performance for mini footprints

congatec has welcomed PICMG's ratification of the COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor. This new specification delivers high-performance capabilities in a small form factor, measuring only 95mm x 70mm. Even devices with limited space can now benefit from COM-HPC's superior bandwidth and interface offerings, including PCIe Gen 5 and Thunderbolt.

COM-HPC has established itself as the most scalable CoM standard, covering a wide range of applications from small form factor designs to edge server designs. This streamlines the design-in process and allows the creation of complete product families with decreased engineering efforts. These modules support specific processors like x86 or Arm and FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.

Christian Eder, chairman of PICMG's COM-HPC Working Group and Director of Market Intelligence at congatec, expresses his enthusiasm for the COM-HPC standard: "COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space-constrained embedded and edge computing designs."

The company is committed to supporting adopting and implementing the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly.