Automotive dual Power MOSFETs offer ultimate space efficiency

Nexperia offers a new range of 80V dual Power-SO8 MOSFETs in the LFPAK56D package. With the addition of this new 80V range of MOSFETs the company now offers the industry’s most comprehensive portfolio of devices, ranging from 30V to 100V. The device is fully automotive qualified to AEC-Q101 and has a proven track record for quality and reliability. The copper clip gull wing package technology offers exceptional board level reliability in thermally demanding applications such as engine management, transmission control and ABS systems. The device offers two isolated MOSFETs in one Power-SO8 package. The device occupies 77% less PCB space than two DPAK’s or 50% less space than a single Power-SO8 device, offering significant savings in space, weight and cost. The release of the new 80V technology extends the company’s LFPAK family, offering customers the flexibility to optimise their design for performance, flexibility and size. Commented Richard Ogden, Nexperia’s product marketing for Automotive MOSFETs: “Engine management is a thermally demanding application space, with PCB modules exposed to harsh temperature cycles. These temperature cycles cause the PCB to expand and contract resulting in significant stress on the PCB solder joints. Due to the unique design of the LFPAK56D these stresses on the PCB solder joints are absorbed resulting in excellent board level reliability. By combining innovative internal and external package features the device is the ideal MOSFET for engine management systems. The device is typically used in applications such as solenoid control, motor control and DC-DC power conversion, with the 80V portfolio specifically aimed at engine management and LED lighting applications.