MOSFETs in robust packages save space, offer high performance and ruggedness

Nexperia has introduced a new series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness. The company is expanding their portfolio to include ultra-low RDS(on) parts that address the ever-increasing demand for higher power density in many typical automotive applications. The new devices are all qualified to AEC-Q101, and exceed the requirements of this international automotive standard by as much as two times on key reliability tests including temperature cycling, high temperature gate bias, high temperature reverse bias and intermittent operating life. Commented Norman Stapelberg, Nexperia’s product marketing manager for Automotive MOSFETs: “To facilitate autonomous driving, automotive manufacturers are requesting dual-redundant circuits for many critical applications such as power steering and braking. The challenge for tier 1 subsystem suppliers is to add the additional power components to their modules without increasing the overall PCB or module size. The unique combination of our Trench 9 superjunction technology with our LFPAK56 and LFPAK56E packaging capability gives Nexperia a performance and reliability advantage, and the reduction in footprint allows customers to add the additional devices required for dual-redundancy without significantly increasing the total PCB area.” Applications include brushed and brushless motor control for power steering, transmission control, ABS, ESC, pumps (water, oil and fuel), fan speed control, reverse battery protection and DC-DC converters. Devices are sampling now.