Automotive ultra-low MOSFETs improve thermal performance

Toshiba Electronics Europe launched their TPWR7940PB and TPW1R104PB, 40V N-channel power MOSFETs using DSOP Advance (WF) packages with double-sided cooling capability. The TPWR7940PB is a 40V max 0.79mOhm MOSFET in DSOP Advance(WF)L package, and the TPW1R104PB is a 40V max 1.14mOhm MOSFET in DSOP Advance(WF)M package. Both devices are based upon the latest trench structure U-MOSIX-H process and are AEC-Q101 qualified. They are aimed at automotive applications including electric power steering, load switches and electric pumps. Both devices are 5mm x 6mm packages with eight pins. The devices differ in their exposed surface area of the top metal plate. The top area is about 8mm² in DSOP Advance(WF)M and about 12mm² in DSOP Advance (WF)L. Measured in the company's test environment, the maximum channel-to-top-plate thermal impedance is 1.5K/W for the TPW1R104PB and 0.93K/W for TPWR7940PB. Their exceptional thermal performance is realised by attaching the top exposed area to a heatsink via an insulating layer. The packages are footprint-compatible with an SOP Advance (WF) package that hasn't any exposed top metal area. The packages use a wettable flank terminal structure that allows AOI of solder joints on PCBs. AOI is particularly important in automotive applications where verification of soldering quality is demanded.