SolidRun has released what is claimed to be the world's first rugged system design that combines eight-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to produce its Bedrock R7000 Edge AI for AI applications. Thi

SolidRun | 02-08-2023

Intertronics has introduced the Dymax 9200-W Series of next-generation light curable encapsulants and structural and optical-positioning adhesives. The range is created with low-sensitising ingredients for products that are touching, or nea

Intertronics | 01-08-2023

Aitech Systems has stated that its SOSA-aligned U-C8500 3U VPX SBC has passed environmental qualification testing. Aligned with The Open Group SOSA Technical Standard, its U-C8500 is based on Intel's ground-breaking SWaP-C optimised Tige

Aitech | 01-08-2023

Impulse Embedded has assured its customers that Intel, who recently announced that they would be exiting the business of complete PC systems, including NUC mini-PCs and kits, is not necessarily a cause for concern. While Intel will be endin

Impulse Embedded | 31-07-2023

Agile Electronics can offer customers a full electronic component kitting service. The company provides customers with a single supplier solution enabling their complete BOM to be loaded into its system as a single line item. This has the a

Agile Electronics | 31-07-2023

Toshiba Electronics Europe GmbH has collaborated with MikroElektronika to incorporate its TB9053 DC-motor driver IC into the DC Motor 26 Click Board to speed up the development of automotive applications. The device supplies a dual H-bri

Toshiba | 31-07-2023

Würth Elektronik now provides a comprehensive components library for Altium designers on GitHub. The ready-for-use component models and detailed data spare designers the exertion of having to compile models of components themselves for use

Wurth | 31-07-2023

THine Electronics, Inc has released its new serial transceiver products, THCS253 and THCS254, that allow systems with many peripheral sensors to simplify cabling for the sensor and control functions. These products facilitate system cost, s

THine Electronics | 25-07-2023

Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated as the damming compound in dam-and-fill encapsulation applications. It can also be employed for bonding and seali

Masterbond | 24-07-2023

Renesas Electronics Corporation now offers a new development board for automotive gateway systems. The R-Car S4 Starter Kit is a low-cost, readily available development board for constructing software employing the Renesas R-Car S4 SoC. The

Renesas | 19-07-2023

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 80 high-performance gap filler pad. This innovative product supplies designers of electronics and telecoms devices with a thermal conductivity of 8.3

Parker Chomerics | 17-07-2023

Review Display Systems has introduced a new ATX motherboard from AAEON. The innovative, high-performance ATX-Q670A supports 12th Generation Intel Core LGA1700 Socket Processors and is AAEON’s first ATX motherboard to provide DDR5 DRAM memor

Review Display | 06-07-2023

MikroElektronika (MIKROE) has expanded its range of wireless connectivity Click boards with the IrDA 4 Click, a compact add-on board that delivers a cost-effective solution for sending and receiving IR serial data. This board features the T

Mikroelektronika | 05-07-2023

Hirose has launched a multi-RF board-to-board connector that delivers a size reduction of up to 71% compared to conventional designs. With the industry’s smallest width of just 2.2mm, the BM56 Series supports multiple RF and digital signals

Hirose | 03-07-2023