Memory


Embedded flash memory devices achieve ASPICE CL2 certification

KIOXIA Europe GmbH, has announced its UFS Ver. 4.0 embedded flash memory devices designed for automotive applications have received Automotive SPICE (ASPICE) Capacity Level 2 (CL2) certification. The company is the first to be awarded this

Kioxia | 09-12-2024

Embedded Flash solution delivers enhanced data retention and best-in-class operational reliability

X-FAB Silicon Foundries SE has announced a major innovation in NVM data storage that draws on its best-in-class SONOS technology. Fabricated on its high-voltage BCD-on-SOI XT011 platform, the company can supply customers with an AECQ100 Gra

X-FAB | 05-12-2024

SSD supports next-generation edge computing and AI advancements

Designed for the edge computing era, Innodisk's E1.S SSD aims to increase performance in AI and edge applications with high reliability and efficiency. The E1.S edge server SSD provides outstanding performance, reliability, and thermal m

Innodisk | 26-11-2024

New processor accelerates computation by up to 50 times

New RISC-V core design with smart memory controller dramatically speeds up calculations and significantly reduces energy consumption Blueshift Memory has released a RISC-V processor reference design that addresses the twin problems facin

Blueshift Memory | 26-11-2024

First complete memory interface chipset solutions for second-generation DDR5 server MRDIMMs

Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 MRDIMMs. The new DDR5 MRDIMMs must keep pace with the ever-increasing memory bandwidth demands

Renesas | 22-11-2024

First radiation-hardened-by-design NOR Flash for space industry applications

Infineon Technologies AG has announced the industry's first radiation-hardened-by-design 512Mbit QSPI NOR Flash memory for space and extreme environment applications. The new device provides a fast quad serial peripheral interface (133MHz)

Infineon | 21-11-2024

Serial NOR Flash portfolio expanded with new high-density devices

Alliance Memory has expanded its Serial NOR Flash product line by introducing three new 3.3V families with a density of 128Mb, 256Mb, and 512Mb. These new products include the AS25F3128MQ-6SIN, AS25F3128MQ-6WINTR, AS25F3256MQ-7S2INTR, AS25F

Alliance Memory | 19-11-2024

New portable memory system achieves 60% reduction in size

ATEK Access Technologies has released the Mini-Bar series, the recent addition to its Datakey brand of rugged portable memory products. Comprising portable memory tokens and mating receptacles, the series provides embedded systems designers

Atek Technology | 19-11-2024

World’s fastest and most energy efficient 60TB SSD

Micron Technology, Inc. has begun qualification of the 6550 ION NVMe SSD with customers. The Micron 6550 ION is the world’s fastest 60TB data centre SSD and the industry’s first E3S and PCIe Gen5 60TB SSD.1 It follows the success of the awa

Micron | 18-11-2024

New CMOS DDR4 SDRAMs combine low power consumption with fast clock speeds

Alliance Memory has expanded its portfolio of CMOS DDR4 SDRAMs with six new 8Gb, 16Gb, and 32Gb devices in 78-ball FBGA and 96-ball FBGA packages. Providing the company's customers with higher-density options for a broad range of applicatio

Alliance Memory | 11-11-2024

DDR5 6400 64GB DRAM series empowers edge AI and generative AI applications

Innodisk has announced its DDR5 6400 DRAM series, featuring the industry's largest 64GB single-module capacity. This 6400 series is purpose-built for data-intensive AI, telehealth, and edge computing applications, where high-edge performanc

Innodisk | 06-11-2024

New 512GB device brings the higher bit density of QLC to UFS

KIOXIA Europe GmbH has announced that it has begun mass-producing the industry's first UFS Ver. 4.0 embedded flash memory devices with 4-bit-per-cell QLC technology. QLC UFS delivers a higher bit density than traditional TLC UFS, making

Kioxia | 05-11-2024

Thermal interface materials and prototyping facility unveiling at show

The Chomerics Division of Parker Hannifin Corporation presents a trio of new thermal interface materials at Electronica 2024. Innovations on show will include new thermal cure-in-place, gap pad and dispensable gel products. The company is a

Parker Chomerics | 05-11-2024

Collaboration between PROM and FPGA in AI model training

In the field of AI, the efficiency and flexibility of model training are crucial for accelerating the development of deep learning. FPGAs have emerged as key hardware accelerators in AI model training due to their high performance, low late

WIN SOURCE | 04-11-2024


Electropages – Your Source for Memory Technology News

Electropages provides in-depth coverage of the latest trends and innovations in memory technology. From groundbreaking SSDs and DRAM series suited for various environments to the latest in flash memory and storage solutions, our platform offers comprehensive insights into the dynamic world of memory technology. We aim to keep professionals and tech enthusiasts updated on the newest products, technologies, and industry developments, ensuring they stay ahead in the rapidly evolving field of memory technology.

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