Toshiba Electronics Europe GmbH introduced the TB67S559FTG 50V/3A stepper motor driver IC, which supports constant current control with built-in current detection. Housed in a 5mm x 5mm QFN32 package, the device operates over a wide 8.2V to

Toshiba | 31-01-2025

Developers require ultra-clean timing devices for aerospace and defence applications where size, weight, and power (SWaP) constraints are critical. A CSAC is an essential reference for these systems, supplying the necessary precise and stab

Microchip Technology | 30-01-2025

Singular Photonics emerged from stealth mode, launching a new generation of image sensors based on SPADs. A spin-out from the University of Edinburgh lab of digital imaging pioneer Professor Robert Henderson, Singular is one of the first co

Singular Photonics | 28-01-2025

Toshiba Electronics Europe GmbH has released seven new 32-bit MCUs with Arm Cortex-M4 cores, expanding its motor control MCU lineup. These devices are ideal for FOC of up to two AC motors, BLDC motors and multiple types of inverter control

Toshiba | 27-01-2025

ROHM has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC series optimised for high-resolution audio playback. Engineered to extract and accurately convert high-resolution s

ROHM Semiconductor | 27-01-2025

Infineon Technologies AG has released PSOC Control, the newest family of high-performance Arm Cortex-M33 based MCUs. With the support of system design tools and software in ModusToolbox, this comprehensive solution permits developers to cre

Infineon | 24-01-2025

Infineon Technologies AG has made notable progress in developing the capacitive micromechanical ultrasonic transducers (CMUT) technology. The technology allows the company to manufacture the first integrated one-chip solution for a MEMS-bas

Infineon | 22-01-2025

The Texas Instruments TMS320F28P55x (F28P55x) is a member of the C2000 real-time MCU family of scalable, ultra-low latency devices developed for efficiency in power electronics, including but not limited to high power density, high switchin

Texas Instruments | 21-01-2025

SiTime Corporation has announced the differential ended SiT5977 Super-TCXO, the newest SiTime Elite RF family member. This is the only single-chip timing solution that provides the most resilient performance for AI compute-nodes with high b

SiTime Corporation | 21-01-2025

Würth Elektronik offers new wireless modules: the freely configurable Orthosie-I model and the Stephano-I variant with pre-installed firmware. Both are based on the ESP32-C3 chipset and communicate according to the IEEE 802.11 b/g/n and Blu

Wurth | 21-01-2025

Automotive manufacturers seek more reliable, energy-efficient, and cost-effective semiconductor solutions that work effectively even under harsh conditions. To meet this demand, Infineon Technologies AG has expanded its portfolio with the M

Infineon | 20-01-2025

Connect more concurrent users with the advanced Wi-Fi 7 capabilities of the Snapdragon® Auto Connectivity Platform from Qualcomm Technologies, Inc. This platform powers RUBY-W2, which supports automotive-grade connectivity with high through

U-Blox | 20-01-2025

ROHM offers samples of the industry’s smallest terahertz (THz) wave oscillation and detection devices using semiconductor elements known as resonance tunnelling diodes (RTDs). Terahertz waves are expected to be applied to non-destructive te

ROHM Semiconductor | 17-01-2025

Allegro MicroSystems, Inc. has launched two new current sensor ICs – the ACS37030MY and the ACS37220MZ. Using its cutting-edge sensing technology, these ICs deliver low internal conductor resistance, high operating bandwidth and reliable pe

Allegro | 17-01-2025