Master Bond EP17HTND-CCM is a new single component epoxy which is not premixed and frozen. The product is more convenient to handle, apply and store than typical two-component glob top systems. The black, heat curable compound has a flowabl

Masterbond | 29-11-2018

Vishay Intertechnology is presenting designers with a new device for IrDA-compliant IR transceiver modules in the standard 6.8mm x 2.8mm x 1.6mm footprint. The company's TFBR4650 provides a reliable drop-in replacement for devices from othe

Vishay | 29-11-2018

HellermannTyton heat-shrinkable moulded shapes blend the advantages of quick, easy installation with high electric strength, mechanical toughness and superior chemical and environmental resistance. These products provide important functiona

TTI Europe | 28-11-2018

Laird PowerCool Direct-to-Air Thermoelectric Assemblies, available now from Mouser, control temperatures in small chambers used in medical diagnostics or sample storage compartments in analytical instrumentation. This assembly's design offe

Mouser Electronics | 28-11-2018

With a new generation of universal temperature transmitters, FlexTop 2212 and 2222, Baumer is extending its range of products. With integrated micro-USB port, automated cable compensation and a fast sampling time of less than 50ms, it is su

Baumer | 28-11-2018

Available now from RDS is the new BOXER-8120AI which has been designed for edge AI computing. The device is equipped with the NVIDIA Jetson TX2 and supports 256 CUDA cores as well as a range of AI Frameworks such as Tensorflow, Caffe2 and M

Review Display | 28-11-2018

Concurrent Technologies has released the SY TR2/525, a 3U VPX development system complete with an eight or 12-core computing board that has a direct PCI Express link to four slots for added peripheral boards. The system is ideal for those

Concurrent | 28-11-2018

EMC filter solutions for three-phase applications are essential elements which add significantly to compliance with the EMC directive and enhance customers’ system reliability and stability. With the launch of the new FN 3287 and FN 3288 se

Scaffner -Proactive | 26-11-2018

TDK Corporation has introduced the RSKN series of 6A, 10A, 20A and 30A, 250VAC/250VDC rated EMC filters. A two-stage design providing high attenuation across a broad 100kHz to 100MHz frequency range and gives protection against high voltage

TDK | 26-11-2018

Abaco Systems has entered into a collaboration with visual technology leader EIZO Rugged Solutions and its NVIDIA Pascal-based products. The collaboration will see the company expanding its existing NVIDIA-based board and system family by u

Abaco Systems | 22-11-2018

Infineon Technologies Prime Block Modules are 20mm, 34mm, and 50mm bipolar modules in solder bond technology. The modules are cost-optimised alternatives to Infineon's pressure contact module technology even in demanding applications. Solde

Mouser Electronics | 21-11-2018

Schaefer has introduced the PBAF 690-560 liquid cooled, high voltage and high current active harmonic filter. This series is perfect for oil platforms, and 600VAC power systems/grids, as well as wind turbine, automation and many other indus

Schaefer Power | 21-11-2018

Texas Instruments DLPC6421 DLP Display Controllers are designed for the DLP 4K UHD display chipset. The controllers, combined with the DLP470TP DMD and DLPA3000/DLPA3005 power management ICs make the display chipset. The display controllers

Texas Instruments | 20-11-2018

Panasonic’s new PAN1762 Series RF Module is a Bluetooth 5.0 LE RF Module based on the Toshiba TC35680 single-chip controller. The new device features allow a higher symbol rate of 2Mbps using the high-speed 2M PHY or a particularly longer r

Panasonic | 20-11-2018