Cadence


Collaboration enables easy adoption of integrated digital full flow

Cadence Design Systems and United Microelectronics Corporation announced that the Cadence digital full flow has been optimised and certified for the UMC 22ULP/ULL process technolog

Design & Manufacture | 16-07-2021

Floating point DSP family delivers scalable performance

Cadence Design Systems has released the Cadence Tensilica FloatingPoint DSP family, which offers a scalable and configurable solution created specifically for floating-point-centri

Design & Manufacture | 22-06-2021

Design platform revolutionises system design

Cadence Design Systems has launched the Cadence Allegro X Design Platform, the industry’s first engineering platform for system design that unifies schematic, analysis, layout, des

Design & Manufacture | 14-06-2021

Collaboration accelerates hyperscale computing and 5G communications SoC development

Cadence Design Systems has announced it is expanding its collaboration with Arm to expedite hyperscale computing and 5G communications SoC development using Cadence tools and the n

New Technologies | 04-05-2021

Extended product line with New DSPs targeting high-end and always-on applications

Cadence Design Systems has expanded its Tensilica Vision DSP product family with the launch of two new DSP IP cores for embedded vision and AI. Packing an industry-leading 3.8TOPS,

Subs & Systems | 27-04-2021

Collaboration Accelerates Hyperscale Computing SoC Design for Process Nodes

Cadence Design Systems has optimised the Cadence digital 20.1 full flow for Samsung Foundry’s advanced-process technologies down to 4nm. Within the collaboration, designers can emp

New Technologies | 13-04-2021

Simulation solution delivers up to 10X faster system-level EMI simulation

Cadence Design Systems has extended its system analysis product line by introducing the Cadence Clarity 3D Transient Solver, a system-level simulation solution that solves EMI syst

New Technologies | 20-10-2020

Multi-standard memory interface IP targets high-capacity low-power and low-cost applications

Cadence Design Systems announced the Cadence IP for GDDR6 is silicon-proven on TSMC’s N6, immediately obtainable on both N6 and N7 and forthcoming for TSMC N5 process technologies.

Semiconductors | 15-10-2020

Die-to-die connectivity IP addressing supports organic substrate packaging

Cadence Design Systems offers its silicon-proven Cadence UltraLink D2D PHY IP on the TSMC N7 process. Test silicon on the process with full silicon characterisation data is now off

Subs & Systems | 02-09-2020

Simulator has been enhanced with machine learning technology

Cadence Design Systems has launched the Cadence Xcelium Logic Simulator, enhanced with machine learning (ML) technology, called Xcelium ML, to further verification throughput. Usin

Test & Measurement | 14-08-2020

Optimised software enables low-power neural network inferencing

Cadence Design Systems has announced that software for Cadence Tensilica HiFi DSPs has been optimised to efficiently execute TensorFlow Lite for Microcontrollers, part of the Tenso

Subs & Systems | 18-03-2020

Extended cloud leadership with new platform for hybrid cloud environments

Cadence Design Systems has announced the availability of the new Cadence CloudBurst Platform for hybrid cloud environments, offering clients with fast and easy access to pre-instal

New Technologies | 03-04-2019

Next-generation cloud datacenter infrastructure delivers industry-leading PPA efficiency

Cadence Design Systems has unveiled what is claimed to be the industry’s first silicon-proven, long-reach 112G SerDes IP in 7nm. The Cadence 7nm 112G PAM-4 SerDes IP produces indus

New Technologies | 24-10-2018