Master Bond’s EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system

Products | 13-07-2016

A new single-component epoxy for demanding bonding, sealing and coating applications, EP3HTS-LO has been developed by Master Bond. The system passes ASTM E595 tests for NASA low ou

Products | 11-05-2016

Formulated for a variety of electronics applications, Master Bond Supreme 3HTND-2CCM is a multi-functional epoxy that is well suited for chip coating, glob top and die attach appli

Products | 23-02-2016

Master Bond has announced its MasterSil 972TC-LO passes the rigorous requirements for low outgassing as per ASTM E595 specifications. It is particularly well suited to use in vacuu

Design & Manufacture | 24-11-2015

Featuring special high thermal conductive fillers, Master Bond EP48TC is a new two-part epoxy paste that can be applied in bond lines as thin as 10-15 microns. The material offers

Products | 08-04-2015