Solid Sand and VyperCore have announced that VyperCore has chosen SuperTest's comprehensive testing and validation suite to ensure compliance with C and C++ language standards for developing its new accelerator chip. This collaboration is p

Solid Sands | 26-11-2024

Mouser introduces its comprehensive RISC-V resource centre, empowering design engineers with knowledge of the latest technology and applications. As open-source architecture gains popularity, RISC-V stands out as a new way to develop cuttin

Mouser Electronics | 25-11-2024

Same Sky’s Interconnect Group has expanded its USB Type C connectors line with a range of new models conforming to the USB 2.0 standard. The UJ20 family boasts ultra-compact package lengths as low as 5.9mm, making them ideal for space-const

Same Sky | 25-11-2024

DELO has developed a new transparent active alignment adhesive. DELO PHOTOBOND OB4210 is characterised by its yellowing stability at high temperatures and is extremely resistant to temperature and media. Manufacturers of automotive headligh

DELO | 25-11-2024

Vishay Intertechnology, Inc. has introduced a new 150V TrenchFET Gen V n-channel power MOSFET in the PowerPAK SO-8S (QFN 6x5) package. Compared to previous-generation devices in the PowerPAK SO-8, the Vishay Siliconix SiRS5700DP slashes ove

Infineon | 25-11-2024

Modern, decentralised, and zonal power distribution architectures need dependable solutions. With PROFET Wire Guard, Infineon Technologies AG supplies developers with advanced wire protection for modern power distribution. Compared to conve

Infineon | 25-11-2024

Sensirion has launched the SEK-SEN66 evaluation kit. It is created for easy and cost-effective evaluation of its all-in-one air quality sensor modules, including SEN60, SEN65, and SEN66. The evaluation kit is part of the company's versat

Sensirion | 25-11-2024

Murata Manufacturing Co. Ltd has extended its line of open-frame AC to DC power supplies with the new PQC600. With its highly efficient and power-dense design, the device caters to the requirements of the latest medical and industrial appli

Murata | 25-11-2024

Toshiba Electronics Europe GmbH has released a new low-voltage, high-speed photorelay. Particularly suited for the pin electronics of semiconductor testers, the TLP3450S makes measuring DUTs at fast speeds more precise. It is also ideal for

Toshiba | 25-11-2024

Würth Elektronik has launched Daphnis-I – a slim, ultra-low power consumption and long-range radio module for IoT applications. Based on the STM32WLE5CCU6 chip, the transceiver works with the LoRaWAN 1.0.4 protocol. This IoT wireless protoc

Wurth | 22-11-2024

Teledyne e2v has announced engineering models of the LX2160-Space 16-core Arm Cortex A72-based SoC processor. These models allow early project design, hardware, and software validation for space-demanding applications. The engineering model

Teledyne e2v | 22-11-2024

Fairview Microwave, an Infinite Electronics brand, has launched its new spring-loaded adapters for the SMP, SMPM, and SMPS connector series. Available in a various lengths, the adapters are designed for high-frequency applications where rel

Fairview Microwave | 22-11-2024

Littelfuse, Inc. has expanded its NanoT tactile switch product line. The series, featuring miniature, surface-mounted, waterproof tactile switches, now incorporates new operational force options and top and side-actuated models, further imp

Littelfuse | 22-11-2024

Samtec, Inc. has announced production quantities of AcceleRate Slim Direct-Attach Cable Assemblies, the industry's slimmest cable system. Measuring 7.6mm wide, this interconnect system saves valuable PCB space, is rated at 64Gbps PAM4 (32Gb

Samtec | 22-11-2024