Designed specifically to enable the integration of ultra-low power communications in SoCs targeting wearables, IoT and other connected devices that require extended battery life and low cost points - Imagination Technologies (IMG.L) has

IMG | 20-04-2015

Following the recent release of the EMBC01, a multi-protocol proximity beacon, EM Microelectronic has launched EMBC02, introducing to the world the power of sensor beacons. The novel combination of sensors with EM’s low-cost, low-power and

EM Microelectronic | 14-04-2015

Expanding its family of eSi-RISC processor cores, EnSilica has launched the eSi-3260, a new processor core aimed at IoT sensing nodes and always-on applications. The eSi-3260 combines advanced DSP functionality with the characteristic e

EnSilica | 14-04-2015

Researchers at Tokyo Institute of Technology have designed a smectic liquid crystal that overcomes many of the challenges posed by organic field effect transistor materials. Crystalline organic semiconductors have attracted a lot of inte

Tokyo Institute of Technology | 13-04-2015

Introduced as the industry’s first, a complete new Wireless M-Bus platform solution, designed to simplify the development of wirelessly connected smart meters for electricity, gas, water and heat resources in the European market, has been u

Silicon Laboratories Inc | 08-04-2015

Dialog Semiconductor has released details of its DA14680 ‘Wearable-on-Chip’ Bluetooth Smart (v4.2) device. The small, ultra-low power integrated circuit includes the key functionality to create a fully-hosted wearable computing product. It

Dialog Semiconductor | 07-04-2015

Atmel has announced it is sampling the industry’s lowest power ARM Cortex-M based solution with power consumption down to 35µA/MHz in active mode and 200nA in sleep mode. The ultra low-power SAM L family broadens the Atmel | SMART 32-b

Atmel | 31-03-2015

Toshiba has announced the development of the world’s first 48-layer three dimensional stacked cell structure flash memory. Sample shipments of 'BiCS', a 2-bit-per-cell 128-gigabit (16 gigabytes) device have commenced, says the company.

Toshiba | 27-03-2015

Fujitsu Laboratories has announced the development of a thin, light-weight beacon (a device that transmits its ID or location information to communicate its existence), weighing 3 grams with a thickness of 2.5 millimetres, that does not req

Fujitsu | 25-03-2015

Altera and strategic IP partner Eutecus have announced availability of the ReCo-Pro Multi-channel High Definition (HD) Video Analytics platform based on Eutecus MVE video and fusion analytics technology and Altera’s Cyclone V SoC and Enpiri

Altera | 25-03-2015

IBM and Semtech have announced a new technology based on low-power, wide-area networks (LPWANs) that offer significant advantages over cellular networks and Wifi for providing machine-to-machine (M2M) communications. For years, the enormous

IBM | 18-03-2015

Announced the industry’s first 50A fully-encapsulated digital DC-DC PMBus power module, the ISL8272M has been unveiled by Intersil. The device is a complete step-down power supply that delivers up to 50A of output current from industry sta

Intersil | 17-03-2015

Cypress Semiconductor HAS announced that networking equipment maker Exablaze has selected Cypress’s QDR-IV SRAM for its ExaLINK Fusion networking switch. The switch utilizes a modular design implemented using a Xilinx Ultrascale FPGA int

Cypress | 11-03-2015

PCB Piezotronics has announced availability of ultra high-temperature (650C) UHT-12 - a new crystal technology is being used in high-temperature applications, called. Accelerometers design with UHT-12 make measurements with better accurac

PCB | 06-03-2015