Teledyne e2v has announced engineering models of the LX2160-Space 16-core Arm Cortex A72-based SoC processor. These models allow early project design, hardware, and software validation for space-demanding applications. The engineering model
Teledyne e2v | 22-11-2024
Toshiba Electronics Europe GmbH has introduced a new gate driver IC series for three-phase BLDC motors in consumer and industrial applications. The TB67Z83xxFTG (with 3.3V regulator output) and TB67Z85xxFTG (with 5V regulator output) series
Toshiba Electronics | 21-11-2024
Murata expands its range of innovative Six Degrees-of-Freedom devices by introducing the SCH1633-D01. The MEMS-based sensor moves the benchmark for performance, system integration, and total cost optimisation. It is designed for various aut
Murata | 19-11-2024
Renesas Electronics Corporation has launched the new generation of automotive fusion SoCs serving multiple automotive domains including ADAS, IVI, and gateway applications on a single-chip. Built employing the latest 3nm automotive process
Renesas | 19-11-2024
Mouser now stocks the STM32MP25 MPU from STMicroelectronics. These industrial-grade 64-bit solutions are for secure Industry 4.0/5.0 and advanced edge computing applications that need high-end multimedia capabilities, such as factory automa
Mouser Electronics | 18-11-2024
Nexperia has introduced a new series of high-performance gate driver ICs for driving high and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration. These devices produce high current output and excellent dynamic per
Nexperia | 18-11-2024
Mouser now stocks Microchip Technology's PIC64GX MPU. The MPU is a 64-bit Linux OS-capable processor that offers an innovative, mid-range, embedded compute platform based on the RISC-V ISA for industrial, aerospace, automotive, defence, com
Mouser Electronics | 15-11-2024
ROHM has developed surface mount SiC SBDs that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models – SCS2xxxNHR – for automotive applications such as OBCs, with plans
ROHM Semiconductor | 15-11-2024
A new solution for forward-looking functional safety with automotive grade protection ICs for EVs and e-Bikes ~ ABLIC has launched the S-19193 Series of automotive three to six-cell battery monitoring protection ICs. BMS for EVs, e-b
ABLIC | 15-11-2024
Renesas Electronics Corporation has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry's first programmable 14-bit SAR ADC. These devices are part of the company's GreenPAK family
Renesas | 15-11-2024
To enable system engineers in the EV industry to take the next step towards transformer-less OBCs, LEM has designed the first automotive-grade residual current monitoring (RCM) type B sensor for bi-directional OBCs with ASIL B capabilities.
LEM | 15-11-2024
The u-blox MAYA-W4 combines Wi-Fi 6, Bluetooth LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem. u-blox has launched the MAYA-W4, a cost-efficient tri-radio module that delivers the latest in wir
U-Blox | 15-11-2024
Toshiba Electronics Europe GmbH has partnered with MIKROE to integrate its robust TB9083FTG gate-driver IC into the Brushless 30 Click, a compact add-on board for precise and reliable control of BLDC motors in automotive applications. To
Toshiba | 14-11-2024
Texas Instruments has released two new series of real-time MCUs, on display at electronica 2024, that deliver advancements to assist engineers in achieving more intelligent and secure processing in automotive and industrial applications. It
Texas Instruments | 13-11-2024