Available now from Mouser, the Texas Instruments AMC1306 reinforced isolated modulators are delta-sigma modulators with the output separated from the input circuitry by a capacitive double isolation barrier. This isolation barrier is highly
Mouser Electronics | 08-06-2017
One of the reasons why cutting-edge connectivity has become so important in factories and similar environments is to facilitate new, smarter ways of working, such as predictive maintenance. Connectivity is a feature of Rittal’s new
Rittal | 07-06-2017
Cypress Semiconductor has announced availability of a new USB-C controller with PD that streamlines the design of power adapters, mobile chargers, car chargers and power banks. The EZ-PD CCG3PA controller supports the PD 3.0 standard with P
Cypress | 06-06-2017
The Texas Instruments DLP LightCrafter display 2010 evaluation module (EVM) is an easy to use, plug and play evaluation platform for the DLP2010 chipset, which includes the DLP2010 digital micromirror device (DMD), DLPC3435 display controll
Texas Instruments | 05-06-2017
Cadence Design Systems has announced the release of the new VirtualBridge Adapter, a virtual emulation technology that accelerates software bring-up in pre-silicon verification versus RTL simulation. The adapter allows software engineers to
Cadence | 05-06-2017
Laird has developed self-contained liquid cooling systems that deliver optimal temperature stabilization for more precise temperature control in particle accelerators like linear accelerators (LINACs) and cyclotron systems. LINACs and cyclo
Laird | 05-06-2017
Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work has been performed and published with additional work published at the 66th Electronic Components and Technol
Zymet Inc. | 05-06-2017
The U-blox VERA-P1 series is the latest in its range of V2X modules designed to accelerate the development of safer and more automated vehicles. The goal of developing safe and reliable self-driving cars can only be realized through technol
U-Blox | 05-06-2017
Microchip has a new family of low-power MCUs featuring CIPs and intelligent analogue for driving LCD. The nine member PIC16F19197 family includes a battery-friendly LCD drive charge pump; 12-bit ADC with computation (ADC2); a low-power comp
Microchip Technology | 02-06-2017
Cypress Semiconductor has announced a new wireless solution that delivers advanced coexistence combining 802.11ac high-performance Wi-Fi, Bluetooth and BLE for IoT applications. The new highly integrated Cypress CYW4373 solution incorporate
Cypress | 02-06-2017
GTK has recommended the use of thick cover lenses to add extra protection to capacitive touch TFT displays that are being used in harsh environments. These cover lenses can be supplied in thicknesses ranging between 1.1mm through to 8mm and
GTK | 02-06-2017
CUI’s Thermal Management Group has expansed its existing portfolio of Peltier devices and DC fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, are compa
CUI Inc | 01-06-2017
Abaco Systems has announced that the DO-178 safety certifiable operating system Deos from DDC-I is now available for their DO-254 certifiable mission ready FORCE 2 rugged display computer, as well as the SBC314 single board computer. Deos i
Abaco Systems | 01-06-2017
Harwin has announced its new Sycamore surface-mount socket which provides superior pin retention and durability for high-volume applications manufactured using advanced automated systems. The design features three points of contact, provid
Harwin | 01-06-2017
25-11-2024 | By Thierry Grenut
21-11-2024 | By Jack Pollard