QuickBuild RF, a partnership between Amphenol RF and Amphenol Custom Cable have introduced FAKRA connectors into its portfolio. These connectors are the newest addition to the expanding connector offerings included within the custom RF cabl

Amphenol | 29-11-2019

EMKA UK is converting the material of their self-clamping gasket profiles to single-piece mouldings in EPDM substituting the previous two-part glued assembly of EPDM and PVC. This indicates that its gaskets have a significantly increased qu

Emka | 29-11-2019

Foremost Electronics now offers the availability of the icotek EMC-KVT-DS, claimed to be the world’s first split EMC cable gland for preassembled cables of thread size M32 which also gives IP54 protection for usage in extreme outdoor condit

Foremost | 27-11-2019

A Single-Arm Composite Backshell developed by Souriau-Sunbank is specifically designed to offer robust and unique performance in terms of reliability and functionality for aerospace defence and other harsh environment applications. The comp

Souriau | 27-11-2019

NXP Semiconductors NTS0302 and NTS0304E Translating Transceivers are 2-bit and 4-bit dual-supply, bi-directional level translators, available now from Mouser. The devices provide auto direction sensing, allowing bi-directional voltage level

Mouser Electronics | 26-11-2019

Master Bond EP29LPTCHT is a two-component, low viscosity epoxy compound that can be effectively employed for underfill and encapsulation applications. It does not require excessive heat for curing and has a long working life at room tempera

Masterbond | 26-11-2019

Arrow Electronics offers the full range of R3 Communications’ ECHORING wireless networking products in EMEA. The products support ultra-reliable, low-latency wireless M2M communications that provide similar performance to current wired syst

Arrow | 26-11-2019

The Spreadfast heatsink is a 1/4 brick DC-DC converter, measuring 62mm x 40mm x 22mm. The heatsinks are now available from RS Components. The devices are extruded, cross-cut and provides an optimised design for specific flow requirements.

RS Components | 25-11-2019

SET (Smart Equipment Technology) has released the NEO HB, an automatic flip-chip bonder designed for ±1µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). The device is ideal for direct hybrid bonding processes. Th

SET | 25-11-2019

The Indium Corporation Durafuse LT is a novel, low-temperature alloy system created to give high-reliability in low-temperature applications that require a reflow temperature below 210C. Where traditional low-temperature solders often produ

Indium Corporation | 25-11-2019

ROLEC has added a new machine/wall pivot mount to its profiPANEL range of command/HMI enclosures. The new pivot mount offers a cost-effective option for mounting these enclosures on suspension arms. It is ideal for loads up to 20kg. The

Rolec Enclosures | 22-11-2019

Toshiba Electronics Europe offers its first-ever range of eFuse IC products. The range comprises of six products in the TCKE8xx series that support multiple protection functions for power supply lines. The TCKE8xx series is offered in th

Toshiba | 22-11-2019

Analog Devices DC2911A Demonstration Circuit is an IEEE 802.3bt compliant, and LTPoE++ interoperable Power over Ethernet (PoE) Powered Device (PD). The device highlights the LT4293 PD interface controller and the LT4321 PoE an ideal diode b

Analog Devices | 21-11-2019

This surface mount Xenon, flashing beacon, 115VAC, 230VAC from RS Components are of the flashing mode type (single-stage alarm) and is ideal for a broad range of local signalling applications where a low cost and energy-efficient solution i

RS Components | 20-11-2019