Infineon Technologies is releasing the Traveo II Body microcontroller family to the open market. This product family addresses a wide assortment of automotive applications, includi
Semiconductors | 09-10-2020
Infineon Technologies meets the demand for SMPS designs in industrial applications where recent technology trends comprise the necessity for high efficiency and power density as we
Power | 07-10-2020
It is now possible to fit traditional wristwatches or luxury models made of metal with a contactless payment function. The Swiss company Winwatch incorporates tiny security chips f
New Technologies | 30-09-2020
With its CoolSiC MOSFET Modular Application Design Kit (MADK) boards Infineon Technologies assists in further decreasing time to market in this important segment. As part of the MA
Power | 09-09-2020
Infineon Technologies has introduced the XDP digital power XDPL8219. The high-performance flyback controller features secondary-side regulation for high-performance and robust LED
Lighting Technologies | 07-09-2020
Biometric payment cards with combined fingerprint sensor make contactless payments more accessible, more secure and hygienic. The contactless card stays in the hands of the cardhol
New Technologies | 19-08-2020
Infineon Technologies has introduced a new IGBT power module specified to the requirements of electric vehicle traction inverters in the 80kW to 100kW power class: the HybridPACK D
Power | 04-08-2020
Infineon Technologies now offers a new product family called Motor System ICs created for control of brushed and brushless DC motors. These ICs are claimed to be the world's first
Automotive & Transport | 10-07-2020
Infineon Technologies offers the EasyPACK module with CoolSiC automotive MOSFET technology, a 1200V half-bridge module with an 8mOhm/150A current rating. Over the previous ten year
Automotive & Transport | 06-07-2020
With the acquisition of Cypress Semiconductor Corporation, Infineon Technologies AG has enhanced its expertise in memory solutions. The company has added Semper Secure to its Sempe
New Technologies | 22-06-2020
Leti has announced that their embedded sensor fusion solution, SigmaFusion, has been embedded in Infineon Technologies’ AURIXTM TC29x platform. This platform enables automotive dev
22-06-2017
