Master Bond EP21ARHTND-2 is a two-part epoxy adhesive developed to withstand prolonged chemical exposure. "The system's chemical resistance was successfully tested in chemicals suc
Test & Measurement | 19-08-2024
Master Bond Supreme 11AOHTLP is a two-component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since
Test & Measurement | 15-07-2024
Master Bond Supreme 11AOHTMed is a two-component epoxy providing thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity a
Industrial | 12-02-2024
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that provides UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a U
Test & Measurement | 05-12-2023
Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically
Medical | 15-08-2023
Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated as the damming compound in dam-and-fill encapsulation
Industrial | 24-07-2023
The Master Bond EP17HTDA-2 is a one-component epoxy that may be employed for bonding, sealing and die attachment. It is not premixed and frozen, and it cures with heat. This dimens
Industrial | 25-04-2023
Master Bond EP41S-5Med is a two-part epoxy system that meets the demands of ISO 10993-5 for non-cytotoxicity and can be employed for sealing, bonding, and coating in medical device
Industrial | 13-02-2023
Master Bond EP40ND is a two-component epoxy system created for bonding, sealing and coating applications. It is a non-drip, toughened system with a simple-to-use 1:1 mix ratio by w
Subs & Systems | 02-08-2022
The Master Bond EP4S-80 is a one-component silver-filled epoxy that meets NASA low outgassing requirements. It offers an unlimited working life at room temperature, and a moderate
Subs & Systems | 10-01-2022
Master Bond EP5G-80 is a one-component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80C for four hours. This graphite filled compound is not pr
Subs & Systems | 01-09-2021
Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an excellent thermal conductivity of 16-17W/(m·K). It cures swiftly at temperatures of around 250-300F (~
Subs & Systems | 22-07-2021
Master Bond MasterSil 153AO is an addition-cured two-part silicone with a self-priming property. It provides a high tensile lap shear strength, especially for a silicone. The syste
Subs & Systems | 19-04-2021
Master Bond EP21NS is a two-part epoxy employed for bonding, sealing, coating and potting/encapsulating. It includes a nanosilica filler that imparts dimensional stability and abra
Subs & Systems | 11-01-2021