Automotive & Transport


USB Type-C receptacle for use in modern vehicles

The Rutronik USB portfolio includes versatile Type C connectors from Molex, suitable for automotive applications. The user-friendly, robust USB Type C receptacle supports currents of up to 5A and speeds of up to 40Gbit/s. Whether as a top,

Rutronik | 28-01-2025

High-spec and space-saving DIN rail power supplies reimagined

RECOM launches its new high-spec, space-saving AC/DC DIN rail power supplies. A breakthrough range of economic, three-phase DIN rail power supplies has been introduced by RECOM in collaboration with their recent acquisition, power specialis

RECOM Power | 27-01-2025

MLCCs in 3225 size for automotive and commercial applications

TDK Corporation has expanded its CGA series for automotive and C series for commercial MLCCs to 10 nF at 1,250 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with C0G characteristics (Class I dielectric). This is the industry's highest ca

TDK | 27-01-2025

New MCUs for motor control in consumer and industrial equipment

Toshiba Electronics Europe GmbH has released seven new 32-bit MCUs with Arm Cortex-M4 cores, expanding its motor control MCU lineup. These devices are ideal for FOC of up to two AC motors, BLDC motors and multiple types of inverter control

Toshiba | 27-01-2025

Tool qualification package provides certified debugging solution for safety-critical applications

TASKING introduces the winIDEA Tool Qualification Support Package (TQSP). The ISO-compliant debugging solution permits it to be the only embedded software tool supplier to deliver a complete development workflow of certified tools for all a

TASKING | 24-01-2025

Control MCU increases performance and efficiency of motor control and power conversion systems

Infineon Technologies AG has released PSOC Control, the newest family of high-performance Arm Cortex-M33 based MCUs. With the support of system design tools and software in ModusToolbox, this comprehensive solution permits developers to cre

Infineon | 24-01-2025

New step-down DC-DC converters with lowest quiescent current enhance design flexibility

Nexperia has introduced a new series of step-down DC-DC converters that provide devices with outstanding stand-by and operating efficiency that offer engineers even greater flexibility for designing various fixed and portable battery-powere

Nexperia | 24-01-2025

High-reliability and low-loss SiC MOSFETs target energy and EV charging applications

SemiQ SiC solutions for ultra-efficient, high-performance, and high-voltage applications, has released a family of 1700V SiC MOSFETs designed to fulfil the requirements of medium-voltage high-power conversion applications, such as photovolt

SemiQ | 24-01-2025

MEMS absolute pressure sensor for automotive and EV thermal management apps

Mouser now stocks the Melexis MLX90834 Triphibian absolute pressure sensor. Expanding upon the company's highly comprehensive family of MLX9083x Triphibian pressure sensors, the new sensor delivers a flexible, robust factory-calibrated MEMS

Mouser Electronics | 22-01-2025

Single-row 1.27mm connectors and cable assemblies for industrial and EV applications

Harwin has expanded its Kontrol range of industrial board-to-board interconnects (BBi), adding single-row connectors and cables to the 1.27mm pitch (0.05") connectors. The range has been designed to bridge the gap between high-end connector

Harwin | 22-01-2025

New PCIe 16-lane switches provides versatility for auto and embedded computing

Efficient management of high-bandwidth data transfer and seamless communication between multiple devices or subsystems are critical in automotive, industrial and data centre applications, making PCIe switches an indispensable solution. They

Microchip Technology | 22-01-2025

MEMS-based ultrasound transducer enables new industrial and medical use cases

Infineon Technologies AG has made notable progress in developing the capacitive micromechanical ultrasonic transducers (CMUT) technology. The technology allows the company to manufacture the first integrated one-chip solution for a MEMS-bas

Infineon | 22-01-2025

Compact haptic reactor achieves a 90% reduction in size

Alps Alpine has released the compact Haptic Reactor 'U-Type', which achieves approximately 90% size reduction (by volume) compared to its predecessors. Maintaining high-vibration performance, this new model can be installed in tight spaces

Alps Alpine | 22-01-2025

Ultra-low latency MCU supports the use of GaN and SiC technologies

The Texas Instruments TMS320F28P55x (F28P55x) is a member of the C2000 real-time MCU family of scalable, ultra-low latency devices developed for efficiency in power electronics, including but not limited to high power density, high switchin

Texas Instruments | 21-01-2025

Articles