U-blox has unveiled the UBX-R3, its proprietary LTE modem technology platform. The platform supports the LARA-R3 module series, the only cellular product in the market to feature a combination of a Cat 1 LTE modem and GNSS technology, all d

U-Blox | 26-09-2016

Plessey has announced the first standard LED module based on its award-winning Stellar beam forming technology. The new standard module opens opportunities for creativity in industrial and architectural lighting design. The Plessey Or

Plessey | 22-09-2016

Fujitsu and Fujitsu Frontech have announced the addition of two new products - the Fujitsu Biometric Authentication PalmSecure-F Pro, which is a sensor that can be embedded into equipment, and the Fujitsu Biometric Authentication Palm Vein

Fujitsu | 13-09-2016

Huber+Suhner has developed a cooled cable and connector that enables High Power Charging of electric vehicles. This development can multiply the power-throughput of a charging cable and keep charging times below 20 minutes (80% state of cha

HUBER+SUHNER | 08-09-2016

Fujitsu has announced that it has built a prototype wireless unit incorporating inter-subarray coding technology, which makes it possible to achieve high-speed transmissions, in excess of 10Gbps, for 5G mobile wireless base stations and acc

Fujitsu | 07-09-2016

Hirose and Harting have reached an agreement on the joint development, product standardization and marketing of a miniaturized connection technology system for 10Gbit Ethernet. The RJ45 was indispensable when using Ethernet ten years ago. H

Hirose | 01-09-2016

Synaptic Laboratories has launched its new memory allocation soft IP (SRAM-T001) for Intel's Altera FPGA devices. The product fills a long standing gap in the Altera Qsys development suite. It makes the finer-grain allocation of SRAM memo

Synaptic Laboratories | 30-08-2016

Semtech has announced the production release of the TS13102 and TS13103 enhanced solid state relays which expand the company’s Neo-Iso product platform and enable self-powered control systems in Internet of Things (IoT) applications, such a

Semtech | 25-08-2016

Toshiba has unveiled the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure[1], a 64-layer device that will be first (as of July 27, 2016. Toshiba survey) in the world to start sample shipm

Toshiba | 28-07-2016

Panasonic Automotive and Industrial Systems Europe has unveiled a thermal insulation sheet which is claimed to be the thinnest insulation solution currently available on the market. The NASBIS (Nano Silica Balloon Insulation Sheet) high-per

Panasonic | 27-07-2016

Analog Devices has introduced a new D/A converter that brings the future of television to today's home viewers, enabling them to enjoy ultra–high-definition (UHD) and 4K television across more channels at unprecedented streaming and downloa

Analog Devices | 14-07-2016

Nordic Semiconductor are developing a low power LTE technology for cellular IoT. Low power cellular IoT is positioning itself to be widely adopted in numerous markets and applications including, for example, smart utility metering, asset an

Nordic | 13-07-2016

Accenture and U-blox are demonstrating a new outdoor asset management concept at the Farnborough International Airshow (FIA), by tracking the golf buggies and VIP courtesy cars used by event organisers to transport people around the 100,000

U-Blox | 06-07-2016

NXP Semiconductors has announced that its highly-advanced technologies for smart cities, including sophisticated vehicle communications solutions, RFID tagging and Smart Card ICs, play a key role in Columbus, Ohio’s winning proposal for

NXP | 30-06-2016