Mouser has announced a new eBook in collaboration with Analog Devices (ADI) and Samtec, exploring the challenges and nuances involved in maintaining signal integrity in our connected world. Between smartphones, computers and emerging fie

Mouser Electronics | 02-08-2024

As embedded systems become more complex and the necessity for improved performance increases, Microchip Technology has launched its dsPIC33A Core family of DSCs. The ability of engineers to create sophisticated, computationally intensive em

Microchip Technology | 02-08-2024

ROHM has developed an ultra-compact 1.8V-5V, rail-to-rail CMOS op–amp, the TLR377GYZ. It is optimised for amplifying signals from sensors such as temperature, pressure, and flow rate, which are used in smartphones, small IoT devices, and si

ROHM Semiconductor | 02-08-2024

The XC7Z030-1FFG676I is a high-performance component of the Xilinx Zynq-7000 series, which incorporates ARM processor cores with FPGA technology to provide users with an efficient and versatile SoC solution. This chip suits high-end communi

WIN SOURCE | 01-08-2024

Magnachip Semiconductor Corporation has completed the development of its 1200V 75A IGBT in a TO-247PLUS package developed for solar inverters. The company entered the solar inverter market in 2020 by introducing the 1200V 40A IGBT (MBQ40

MagnaChip | 01-08-2024

Alphawave Semi has launched the industry's first successful 3 nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology. The comp

Alphawave Semi | 01-08-2024

Mouser has teamed up with Infineon Technologies to offer the engineering community a new webinar titled 'Seamless Integration: Simplifying Secured Matter Compatibility and Security in Matter Designs'. The free webinar will take place on 27

Mouser Electronics | 31-07-2024

Mouser's comprehensive wireless networking content hub provides engineers with the latest resources for networking standards. In an era of heightened connectivity, networking standards ensure seamless integration in daily interactions. Wi-F

Mouser Electronics | 30-07-2024

The Texas Instruments TCAN1473-Q1 is a high-speed CAN transceiver that meets the physical layer needs of the ISO 11898-2:2024 high-speed CAN specification. The device supports classical CAN and CAN FD data rates up to 8Mbps. The device a

Texas Instruments | 30-07-2024

Navitas Semiconductor has released its 4.5kW AI data centre power supply reference design with optimised GaNSafe and Gen-3 'Fast' (G3F) SiC power components. The optimised design facilitates the world's highest power density with 137W/in3 a

Navitas Semiconductor | 30-07-2024

WIN SOURCE presents the popular A4952ELYTR-T motor driver from Allegro MicroSystems. The device is a specialised device designed for PWM control of DC motors, able to handle peak output currents up to ±2A and operating voltages up to 40V. T

WIN SOURCE | 29-07-2024

Inelco Hunter has launched a powerful, ultra-small SoM designed for applications demanding compactness and energy efficiency. This innovative SoM leverages the SMARC standard, a widely recognised industry specification for compact, low-powe

Inelcohunter | 29-07-2024

Renesas Electronics Corporation has announced a complete space-ready reference design for the AMD Versal AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates k

Renesas | 24-07-2024

Daihen Corporation has selected Infineon Technologies AG's CoolSiC 2000V modules for their innovative unit-type power conditioners for grid storage batteries. In the journey towards lowering carbon emissions, grid storage batteries and the

Infineon | 24-07-2024