Navitas Semiconductor extends its new portfolio of Gen-3 'Fast' (G3F) 650V SiC MOSFETs into a thermally-enhanced, rugged, high-speed, surface-mount TOLL package designed for demanding, high-power, high-reliability applications. Combining
Navitas Semiconductor | 07-08-2024
Mouser now stocks the new i.MX 8ULP crossover applications processors from NXP Semiconductors. The device brings ultra-low power processing and advanced integrated security with EdgeLock secure enclave to simplify complex security implement
Mouser Electronics | 06-08-2024
Sondrel has optimised its SFA 100 to make it ideal for battery-powered, AI at the Edge applications. The SFA 100 is one of the five architectural platforms in the company’s Architecting the Future chip design platform, which supplies a read
Sondrel | 06-08-2024
Infineon Technologies AG has introduced a new series of MCUs for next-generation industrial and consumer motor control and power conversion system applications. These include home appliances, power tools, renewable energy products, industri
Infineon | 06-08-2024
Mouser has announced a new eBook in collaboration with Analog Devices (ADI) and Samtec, exploring the challenges and nuances involved in maintaining signal integrity in our connected world. Between smartphones, computers and emerging fie
Mouser Electronics | 02-08-2024
As embedded systems become more complex and the necessity for improved performance increases, Microchip Technology has launched its dsPIC33A Core family of DSCs. The ability of engineers to create sophisticated, computationally intensive em
Microchip Technology | 02-08-2024
ROHM has developed an ultra-compact 1.8V-5V, rail-to-rail CMOS op–amp, the TLR377GYZ. It is optimised for amplifying signals from sensors such as temperature, pressure, and flow rate, which are used in smartphones, small IoT devices, and si
ROHM Semiconductor | 02-08-2024
The XC7Z030-1FFG676I is a high-performance component of the Xilinx Zynq-7000 series, which incorporates ARM processor cores with FPGA technology to provide users with an efficient and versatile SoC solution. This chip suits high-end communi
WIN SOURCE | 01-08-2024
Magnachip Semiconductor Corporation has completed the development of its 1200V 75A IGBT in a TO-247PLUS package developed for solar inverters. The company entered the solar inverter market in 2020 by introducing the 1200V 40A IGBT (MBQ40
MagnaChip | 01-08-2024
Alphawave Semi has launched the industry's first successful 3 nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology. The comp
Alphawave Semi | 01-08-2024
Mouser has teamed up with Infineon Technologies to offer the engineering community a new webinar titled 'Seamless Integration: Simplifying Secured Matter Compatibility and Security in Matter Designs'. The free webinar will take place on 27
Mouser Electronics | 31-07-2024
Mouser's comprehensive wireless networking content hub provides engineers with the latest resources for networking standards. In an era of heightened connectivity, networking standards ensure seamless integration in daily interactions. Wi-F
Mouser Electronics | 30-07-2024
The Texas Instruments TCAN1473-Q1 is a high-speed CAN transceiver that meets the physical layer needs of the ISO 11898-2:2024 high-speed CAN specification. The device supports classical CAN and CAN FD data rates up to 8Mbps. The device a
Texas Instruments | 30-07-2024
Navitas Semiconductor has released its 4.5kW AI data centre power supply reference design with optimised GaNSafe and Gen-3 'Fast' (G3F) SiC power components. The optimised design facilitates the world's highest power density with 137W/in3 a
Navitas Semiconductor | 30-07-2024