Semiconductors


AI and EVs powered with fast SiC MOSFETs in robust TOLL package

Navitas Semiconductor extends its new portfolio of Gen-3 'Fast' (G3F) 650V SiC MOSFETs into a thermally-enhanced, rugged, high-speed, surface-mount TOLL package designed for demanding, high-power, high-reliability applications. Combining

Navitas Semiconductor | 07-08-2024

Crossover applications processors deliver low-power processing and integrated security

Mouser now stocks the new i.MX 8ULP crossover applications processors from NXP Semiconductors. The device brings ultra-low power processing and advanced integrated security with EdgeLock secure enclave to simplify complex security implement

Mouser Electronics | 06-08-2024

Architectural platform is ideal for AI at the Edge

Sondrel has optimised its SFA 100 to make it ideal for battery-powered, AI at the Edge applications. The SFA 100 is one of the five architectural platforms in the company’s Architecting the Future chip design platform, which supplies a read

Sondrel | 06-08-2024

MCU family targets motor control and power conversion in industrial and consumer applications

Infineon Technologies AG has introduced a new series of MCUs for next-generation industrial and consumer motor control and power conversion system applications. These include home appliances, power tools, renewable energy products, industri

Infineon | 06-08-2024

New eBook offers expert perspectives on signal integrity

Mouser has announced a new eBook in collaboration with Analog Devices (ADI) and Samtec, exploring the challenges and nuances involved in maintaining signal integrity in our connected world. Between smartphones, computers and emerging fie

Mouser Electronics | 02-08-2024

New core in DSC family enhances precision and execution of real-time control

As embedded systems become more complex and the necessity for improved performance increases, Microchip Technology has launched its dsPIC33A Core family of DSCs. The ability of engineers to create sophisticated, computationally intensive em

Microchip Technology | 02-08-2024

Smallest CMOS op-amp optimised for smartphones and compact IoT devices

ROHM has developed an ultra-compact 1.8V-5V, rail-to-rail CMOS op–amp, the TLR377GYZ. It is optimised for amplifying signals from sensors such as temperature, pressure, and flow rate, which are used in smartphones, small IoT devices, and si

ROHM Semiconductor | 02-08-2024

Integrated FPGA solution drives next-generation system design

The XC7Z030-1FFG676I is a high-performance component of the Xilinx Zynq-7000 series, which incorporates ARM processor cores with FPGA technology to provide users with an efficient and versatile SoC solution. This chip suits high-end communi

WIN SOURCE | 01-08-2024

New IGBT added to solar energy power product lineup

Magnachip Semiconductor Corporation has completed the development of its 1200V 75A IGBT in a TO-247PLUS package developed for solar inverters. The company entered the solar inverter market in 2020 by introducing the 1200V 40A IGBT (MBQ40

MagnaChip | 01-08-2024

First 3nm UCIe IP with TSMC CoWoS packaging launched

Alphawave Semi has launched the industry's first successful 3 nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology. The comp

Alphawave Semi | 01-08-2024

Companies present webinar on creating secure and simplified Matter IoT devices

Mouser has teamed up with Infineon Technologies to offer the engineering community a new webinar titled 'Seamless Integration: Simplifying Secured Matter Compatibility and Security in Matter Designs'. The free webinar will take place on 27

Mouser Electronics | 31-07-2024

Empowering engineers with cutting-edge wireless networking hub

Mouser's comprehensive wireless networking content hub provides engineers with the latest resources for networking standards. In an era of heightened connectivity, networking standards ensure seamless integration in daily interactions. Wi-F

Mouser Electronics | 30-07-2024

Automotive low-power signal improvement CAN FD transceiver

The Texas Instruments TCAN1473-Q1 is a high-speed CAN transceiver that meets the physical layer needs of the ISO 11898-2:2024 high-speed CAN specification. The device supports classical CAN and CAN FD data rates up to 8Mbps. The device a

Texas Instruments | 30-07-2024

Overcoming AI challenges with highest power density data centre design

Navitas Semiconductor has released its 4.5kW AI data centre power supply reference design with optimised GaNSafe and Gen-3 'Fast' (G3F) SiC power components. The optimised design facilitates the world's highest power density with 137W/in3 a

Navitas Semiconductor | 30-07-2024

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