Semiconductors


Cellular-to-cloud dev kits connect seamlessly to Azure Cloud Services

Renesas Electronics Corporation has announced that its cellular-to-cloud development kits powered by Renesas' 32-bit MCUs now fully support Microsoft's Azure cloud services. The two Cloud Kits – the CK-RA6M5 and CK-RX65N – allow users to co

Renesas | 14-04-2023

SiC solutions for energy infrastructure and industrial drive applications

Mouser now stocks the EliteSiC SiC) family of solutions from onsemi. This portfolio includes diodes, MOSFETs, IGBT and SiC diode PIMs, and AEC-Q100-qualified devices. These devices are optimised to deliver reliable, high-efficiency performa

Mouser Electronics | 12-04-2023

SOM for IoT robotics and machine learning applications

Mouser now stocks the Summit SOM 8M Plus from Laird Connectivity. This SOM is an integrated and comprehensive hardware and software powerhouse combining NXP's multi-core processing, dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity for a

Mouser Electronics | 06-04-2023

RISC-V embedded processing portfolio has new voice-control ASSP solution

Renesas Electronics Corporation has expanded its industry-leading RISC-V portfolio with the first RISC-V MCU developed for voice-controlled HMI systems. The new R9A06G150 32-bit ASSP, created in collaboration with RISC-V ecosystem partners,

Renesas | 06-04-2023

Space-saving TVS provides superior ESD and surge protection for high-speed I/Os

Diodes Incorporated has released its new bidirectional TVS diode, addressing market demands for a robust protection for high-speed data ports. The D3V3Z1BD2CSP is intended to provide protection from ESD strikes and surge events. The main ap

Diodes Inc | 04-04-2023

Ultra-high-speed control IC technology maximises performance of GaN devices

ROHM's ultra-high-speed Control IC technology maximises the performance of GaN and other high-speed switching devices. While the adoption of GaN devices has grown in recent years due to their outstanding high-speed switching characteristics

ROHM Semiconductor | 31-03-2023

Industrial MPU provides fast and accurate real-time control with EtherCAT communication

Renesas Electronics Corporation offers a new industrial MPU that supports the EtherCAT communication protocol, attaining high-speed, accurate real-time control for industrial systems. The RZ/T2L MPU inherits the hardware architecture of its

Renesas | 31-03-2023

Showcasing the latest modules with capacitors and relays

Mouser is showcasing the latest innovations from Panasonic Corporation to offer manufacturers the latest in Panasonic performance, quality and reliability, building world-class solutions for customers in virtually all industries, including

Mouser Electronics | 30-03-2023

Multi-protocol wireless module offers extensive communication capabilities

Murata has further boosted its portfolio of state-of-the-art wireless communication modules. The company’s new LBEE5XV2EA solution employs an Infineon CYW55573 SoC. As well as supporting 2.4GHz and 5GHz operation, the module can also transm

Murata | 29-03-2023

GaN flyback switcher ICs target industrial applications and automotive power supplies

Power Integrations has launched a 900V GaN extension to the company’s InnoSwitch3 family of flyback switcher ICs. The new ICs, which offer the company’s proprietary PowiGaN technology, deliver up to 100W with better than 93% efficiency, era

Power Integrations | 29-03-2023

Compact and high-performance SolidGaN integrated half-bridge solution with driver

Innoscience Technology has released the first in a new family of SolidGaN-integrated GaN devices. ISG3201 is a complete half-bridge circuit comprising two 100V 3.2mOhm InnoGaN HEMTs and the necessary driver circuitry in an LGA package measu

Innoscience Technology | 28-03-2023

Bare die SiC selected for the newest line of power modules

ROHM has revealed that Apex Microtechnology is adopting its SiC MOSFETs and SiC SBD for a new series of power modules. This product family includes the three-phase SA310 module, excellent for driving high-voltage BLDC motors, and two half-b

ROHM Semiconductor | 28-03-2023

Revolutionary new GaN-based OBC reference design for EV applications

GaN Systems has released a new GaN-based 11kW/800V OBC reference design that provides 36% higher power density and up to 15% lower BOM cost than SiC transistors. Using GaN transistors in an 800V OBC is a revolutionary innovation setting

GaN Systems | 28-03-2023

Wireless module offers Wi-Fi 6 Bluetooth and IEEE 802.15.4 LR-WPAN connectivity together

Murata introduces the new LBES5PL2EL module. The device is highly optimised to satisfy the strict demands of next-generation IoT hardware – where having Matter connectivity is becoming an increasingly important expectation. This module is b

Murata | 27-03-2023

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